是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 包装说明: | DIP, DIP14,.3 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.92 | JESD-30 代码: | R-PDIP-T14 |
JESD-609代码: | e0 | 逻辑集成电路类型: | NAND GATE |
最大I(ol): | 0.016 A | 湿度敏感等级: | 2A |
端子数量: | 14 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | DIP | 封装等效代码: | DIP14,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | 250 | 电源: | 5 V |
最大电源电流(ICC): | 6 mA | Prop。Delay @ Nom-Sup: | 22 ns |
施密特触发器: | NO | 子类别: | Gates |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | TTL | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
74300-0001 | MOLEX | 2.00mm (.079") Pitch HDM® Board-to-Board Daug |
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743000123 | MOLEX | 2.00mm (.079") Pitch HDM® Board-to-Board Daug |
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74300-0125 | MOLEX | Board Connector, 72 Contact(s), 6 Row(s), Female, Straight, Solder Terminal |
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74300-0127 | MOLEX | 2.00mm (.079") Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, |
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74300-0133 | MOLEX | 2.00mm (.079") Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, |
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74300-0134 | MOLEX | Board Connector, 72 Contact(s), 6 Row(s), Female, Straight, Solder Terminal |
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