5秒后页面跳转
736441017 PDF预览

736441017

更新时间: 2024-02-25 23:05:59
品牌 Logo 应用领域
莫仕 - MOLEX 连接器
页数 文件大小 规格书
3页 228K
描述
144 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

736441017 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ActiveReach Compliance Code:unknown
风险等级:5.19其他特性:H SPEED SIG INTEGRITY, H INTERCONNECT DENSITY, ALWAYS DELIVERED AS COMPLETE CONNECTOR ON A STIFFNER
连接器类型:BOARD CONNECTOR联系完成配合:NOT SPECIFIED
联系完成终止:NOT SPECIFIED触点性别:MALE
触点材料:NOT SPECIFIEDDIN 符合性:NO
滤波功能:NOIEC 符合性:NO
MIL 符合性:NO插接信息:MULTIPLE MATING PARTS AVAILABLE
混合触点:NO安装方式:STRAIGHT
安装类型:BOARD装载的行数:6
端子节距:2 mm端接类型:SOLDER
触点总数:144Base Number Matches:1

736441017 数据手册

 浏览型号736441017的Datasheet PDF文件第2页浏览型号736441017的Datasheet PDF文件第3页 
              
2.00mm (.079") Pitch  
HDM*  
Board-to-Board  
Backplane Header  
FEATURES AND SPECIFICATIONS  
Features and Benefits  
Electrical  
Current: ꢀ10A  
Contact Resistance:  
  Similar features as the 73642 header  
  Eye of the needle press-fit for high reliability  
  Metal hex key offers 8 coding combinations (64 with  
2 keys) and makes metallic sound when card is in  
wrong slot  
A
B
C
D
E
F
Row  
mΩ  
ꢀ3  
ꢀ8  
20  
25  
30  
32  
max.  
  Guide pin provides ꢀ1.mm of capture prior to plastic  
mating  
  Can use ꢀ guide pin in center of connector or on both ends  
  Guide pin module attached to header enhances accuracy  
and reduces parts count  
Dielectric Withstanding Voltage: ꢀ000V  
Insulation Resistance: ꢀ000 Mmin1  
73644  
Vertical  
Press-Fit Guide Pin Option  
Mechanical  
Insertion Force: ꢀ35N max1 per press-fit pin  
Retention Force: 2215N min1 per press-fit pin  
Mating Force: 0135N typical per contact  
Unmating Force: 01ꢀ5N min1  
  Surface Mount Compatible  
Reference Information  
Product Specification: PS-73670-....  
Packaging: Tube  
UL File No1: E2.ꢀ7.  
Mates With: 73632 and 73780  
Designed In: Millimeters  
Signal Normal Force: 0175N nom1/0160N min1  
Durability: 250 cycles  
Physical  
Housing: Liquid crystal polymer  
Contact: Phosphor Bronze  
Plating: 30µ" Gold  
Operating Temperature: -55 to +ꢀ05˚C  
CATALOG DRAWING (FOR REFERENCE ONLY)  
J
017ꢀ  
DIA plated thru hole TYP  
1028  
01838  
DIA drilled hole  
010330  
ORDERING INFORMATION AND DIMENSIONS  
Order No.  
Dimension  
Circuits  
Termination  
Location B = Pin  
Location B = No Code  
Location A = Pin  
Location B = Pin  
Location B = Code A  
Location A = Pin  
A
B
M
Location A = No Code  
Location A = Code A  
73644-00ꢀ6  
73644-02ꢀ6  
73644-20ꢀ6  
73644-22ꢀ6  
73644-ꢀ0ꢀ6  
73644-ꢀ2ꢀ6  
73644-30ꢀ6  
73644-32ꢀ6  
73650-XXXX  
73644-00ꢀ7  
73644-02ꢀ7  
73644-20ꢀ7  
73644-22ꢀ7  
73644-ꢀ0ꢀ7  
73644-ꢀ2ꢀ7  
73644-30ꢀ7  
73644-32ꢀ7  
73650-XXXX  
73644-0000  
73644-0200  
73644-2000  
73644-2200  
73644-ꢀ000  
73644-ꢀ200  
73644-3000  
73644-3200  
73650-XXXX  
73644-000ꢀ  
73644-020ꢀ  
73644-200ꢀ  
73644-220ꢀ  
73644-ꢀ00ꢀ  
73644-ꢀ20ꢀ  
73644-300ꢀ  
73644-320ꢀ  
73650-XXXX  
Standard Press-Fit  
Standard Press-Fit  
Tin/Lead Press-Fit  
Tin/Lead Press-Fit  
Standard Press-Fit  
Standard Press-Fit  
Tin/Lead Press-Fit  
Tin/Lead Press-Fit  
Custom  
3ꢀ160 (ꢀ1244)  
3ꢀ160 (ꢀ1244)  
3ꢀ160 (ꢀ1244)  
3ꢀ160 (ꢀ1244)  
55160 (21ꢀ8.)  
55160 (21ꢀ8.)  
55160 (21ꢀ8.)  
55160 (21ꢀ8.)  
Custom  
22100 (1866)  
22100 (1866)  
22100 (1866)  
22100 (1866)  
46100 (ꢀ18ꢀꢀ)  
46100 (ꢀ18ꢀꢀ)  
46100 (ꢀ18ꢀꢀ)  
46100 (ꢀ18ꢀꢀ)  
Custom  
5100 (1ꢀ.7)  
6100 (1236)  
5100 (1ꢀ.7)  
6100 (1236)  
5100 (1ꢀ.7)  
6100 (1236)  
5100 (1ꢀ.7)  
6100 (1236)  
Custom  
72  
ꢀ44  
Custom  
* High Density Metric and HDMPLUS are trademarks of Teradyne, Inc1  
Application Note  
Note: Additional key combinations and locations are available, please contact Molex  
Note: Tin/Lead press-fit zones are used for bare Copper or Gold plated PCBs  
The backplane headers are delivered as modules and are press-fitted into the backplane1 This  
allows maximum flexibility with minimum inventory1 Note that the guidepins are an integral  
part of the headers1 This also means that you may have different part numbers for left-  
handed and right-handed headers1 You must consult the customer print to determine the  
appropriate part number for various combinations of guide pin locations (2) and coding pin  
orientations (8)1  
Note: The guide pin must mate with the top position on the mating receptacle to clear the board edge1 Therefore, if  
guidepin headers are used on each end of a header array, you should select one with the pin in location B and the  
second with the guidepin in location A1  
J-36  
MX01  

与736441017相关器件

型号 品牌 获取价格 描述 数据表
73644-1017 MOLEX

获取价格

2.00mm (.079") Pitch HDM® Board-to-Board Back
73644-1018 MOLEX

获取价格

2.00mm (.079") Pitch HDM® Board-to-Board Back
73644-1101 MOLEX

获取价格

2.00mm (.079") Pitch HDM® Board-to-Board Back
73644-1107 MOLEX

获取价格

2.00mm (.079") Pitch HDM® Board-to-Board Back
73644-1116 MOLEX

获取价格

2.00mm (.079") Pitch HDM® Board-to-Board Back
73644-1117 MOLEX

获取价格

2.00mm (.079") Pitch HDM® Board-to-Board Back
736441200 MOLEX

获取价格

144 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
73644-1200 MOLEX

获取价格

2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide
73644-1201 MOLEX

获取价格

2.00mm (.079") Pitch HDM® Board-to-Board Back
73644-1202 MOLEX

获取价格

2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide