是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8536.69.40.40 |
风险等级: | 5.76 | 其他特性: | POLARIZED,HDM |
板上安装选件: | COMPLIANT BOARDLOCK | 主体宽度: | 0.618 inch |
主体深度: | 0.461 inch | 主体长度: | 2.189 inch |
主体/外壳类型: | RECEPTACLE | 连接器类型: | BOARD CONNECTOR |
联系完成配合: | NOT SPECIFIED | 联系完成终止: | GOLD FLASH |
触点性别: | MALE | 触点材料: | NOT SPECIFIED |
触点模式: | RECTANGULAR | 触点电阻: | 10 m Ω |
触点样式: | SQ PIN-SKT | DIN 符合性: | NO |
滤波功能: | NO | IEC 符合性: | NO |
最大插入力: | .6116 N | 绝缘电阻: | 5000000000 Ω |
绝缘体颜色: | BLACK | 绝缘体材料: | GLASS FILLED LIQUID CRYSTAL POLYMER |
JESD-609代码: | e4 | MIL 符合性: | NO |
插接触点节距: | 0.079 inch | 匹配触点行间距: | 0.079 inch |
插接信息: | MULTIPLE MATING PARTS AVAILABLE | 混合触点: | NO |
安装选项1: | GUIDE PIN | 安装选项2: | LOCKING |
安装方式: | STRAIGHT | 安装类型: | BOARD |
连接器数: | ONE | PCB行数: | 6 |
装载的行数: | 6 | 最高工作温度: | 105 °C |
最低工作温度: | -55 °C | 选件: | GENERAL PURPOSE |
PCB接触模式: | RECTANGULAR | PCB触点行间距: | 2.0066 mm |
电镀厚度: | 30u inch | 额定电流(信号): | 1 A |
参考标准: | UL | 可靠性: | COMMERCIAL |
子类别: | Headers and Edge Type Connectors | 端子长度: | 0.138 inch |
端子节距: | 2 mm | 端接类型: | PRESS FIT |
触点总数: | 144 | UL 易燃性代码: | 94V-0 |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
73644-1212 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back | |
73644-1213 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back | |
73644-1215 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back | |
736441216 | MOLEX |
获取价格 |
144 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER | |
73644-1216 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back | |
73644-1217 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back | |
73644-1218 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back | |
73644-2000 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back | |
73644-2001 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back | |
73644-2009 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |