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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 709-225-15U-LA-D | COOPER |
获取价格 |
IC Socket, PGA225, 225 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Wire Wrap |
|
| 709-225-15U-LBT-E | COOPER |
获取价格 |
PGA SOCKET,225 CONTACTS,15X15,0.1 ROW SPACING,WRAP POST TERMINAL |
|
| 709-225-15U-SM-L | COOPER |
获取价格 |
PGA SOCKET,225 CONTACTS,15X15,0.1 ROW SPACING,SURFACE MOUNT TERMINAL |
|
| 709-230-17M-LC-B | COOPER |
获取价格 |
PGA SOCKET,230 CONTACTS,17X17,0.1 ROW SPACING,PC TAIL TERMINAL |
|
| 709-230-17M-LC-D | COOPER |
获取价格 |
IC Socket, PGA230, 230 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder |
|
| 709-230-17M-SM-L | COOPER |
获取价格 |
IC Socket, PGA230, 230 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Surface Mount |
|
| 709269L12G | IDT |
获取价格 |
Application Specific SRAM, 16KX16, 12ns, CMOS, CPGA108, PGA-108 |
|
| 709269L12G8 | IDT |
获取价格 |
Application Specific SRAM, 16KX16, 12ns, CMOS, CPGA108, PGA-108 |
|
| 709269L12GI | IDT |
获取价格 |
Application Specific SRAM, 16KX16, 12ns, CMOS, CPGA108, PGA-108 |
|
| 709269L12GI8 | IDT |
获取价格 |
Application Specific SRAM, 16KX16, 12ns, CMOS, CPGA108, PGA-108 |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
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