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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 70246-4621 | MOLEX |
获取价格 |
Board Connector, 46 Contact(s), 2 Row(s), Male, Straight, Solder Terminal |
|
| 70246-4821 | MOLEX |
获取价格 |
Board Connector, 48 Contact(s), 2 Row(s), Male, Straight, Solder Terminal |
|
| 70246-4822 | MOLEX |
获取价格 |
Board Connector, 48 Contact(s), 2 Row(s), Male, Straight, Solder Terminal |
|
| 70246-5001 | MOLEX |
获取价格 |
2.54mm (.100") Pitch C-Grid® Header, Low Prof |
|
| 70246-5002 | MOLEX |
获取价格 |
2.54mm (.100") Pitch C-Grid® Header, Low Prof |
|
| 70246-5004 | MOLEX |
获取价格 |
2.54mm (.100") Pitch C-Grid® Header, Low Prof |
|
| 70246-5021 | MOLEX |
获取价格 |
Board Connector, 50 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 70246-5022 | MOLEX |
获取价格 |
Board Connector, 50 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 70246-5023 | MOLEX |
获取价格 |
Board Connector, 50 Contact(s), 2 Row(s), Male, Straight, Solder Terminal |
|
| 70246-5045 | MOLEX |
获取价格 |
Board Connector, 50 Contact(s), 2 Row(s), Male, Straight, Solder Terminal |
|
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
AMD宣布全球裁员约1000人，调整战略聚焦增长
英伟达新AI芯片Rubin或提前半年亮相
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