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65LBC174AM16DWREP PDF预览

65LBC174AM16DWREP

更新时间： 2023-06-19 15:34:39
品牌 Logo 应用领域
德州仪器 - TI 驱动信息通信管理光电二极管接口集成电路驱动器
页数 文件大小 规格书
19页 552K
描述
增强型产品四路 RS-485/RS-422 差分线路驱动器 | DW | 16 | -55 to 125

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65LBC174AM16DWREP 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：DIP
包装说明：DIP, DIP16,.3针数：16
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：0.89
差分输出：YES驱动器位数：4
高电平输入电流最大值：0.0001 A输入特性：STANDARD
接口集成电路类型：LINE DRIVER接口标准：EIA-485
JESD-30 代码：R-PDIP-T16JESD-609代码：e4
长度：19.305 mm功能数量：4
端子数量：16最高工作温度：85 °C
最低工作温度：-40 °C最小输出摆幅：1.1 V
输出特性：3-STATE最大输出低电流：0.00006 A
输出极性：COMPLEMENTARY封装主体材料：PLASTIC/EPOXY
封装代码：DIP封装等效代码：DIP16,.3
封装形状：RECTANGULAR封装形式：IN-LINE
峰值回流温度（摄氏度）：NOT SPECIFIED电源：5 V
认证状态：Not Qualified最大接收延迟：
座面最大高度：5.08 mm子类别：Line Driver or Receivers
最大压摆率：7 mA最大供电电压：5.25 V
最小供电电压：4.75 V标称供电电压：5 V
电源电压1-最大：5.25 V电源电压1-分钟：4.75 V
电源电压1-Nom：5 V表面贴装：NO
技术：BICMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：THROUGH-HOLE
端子节距：2.54 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED最大传输延迟：20 ns
宽度：7.62 mmBase Number Matches：1

65LBC174AM16DWREP 数据手册

 浏览型号65LBC174AM16DWREP的Datasheet PDF文件第2页浏览型号65LBC174AM16DWREP的Datasheet PDF文件第3页浏览型号65LBC174AM16DWREP的Datasheet PDF文件第4页浏览型号65LBC174AM16DWREP的Datasheet PDF文件第5页浏览型号65LBC174AM16DWREP的Datasheet PDF文件第6页浏览型号65LBC174AM16DWREP的Datasheet PDF文件第7页 
SN65LBC174A-EP  
QUADRUPLE RS-485 DIFFERENTIAL LINE DRIVER  
www.ti.com  
SLLS732–OCTOBER 2006–REVISED DECEMBER 2006  
FEATURES  
•
Controlled Baseline  
20-PIN DW PACKAGE  
(TOP VIEW)  
–
One Assembly/Test Site, One Fabrication  
Site  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
1A  
1Y  
NC  
V
CC  
4A  
4Y  
NC  
4Z  
3,4EN  
3Z  
NC  
3Y  
•
•
Extended Temperature Performance of –55°C  
to 125°C  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
1Z  
1,2EN  
2Z  
NC  
2Y  
2A  
GND  
•
•
•
Enhanced Product-Change Notification  
(1)  
Qualification Pedigree  
Designed for TIA/EIA-485, TIA/EIA-422, and  
ISO 8482 Applications  
3A  
(2)  
•
•
•
•
•
•
Signaling Rates up to 30 Mbps  
Propagation Delay Times <11 ns  
Low Standby Power Consumption 1.5 mA Max  
Output ESD Protection Exceeds 13 kV  
Driver Positive- and Negative-Current Limiting  
logic diagram (positive logic)  
Power-Up and Power-Down Glitch Free for  
Line-Insertion Applications  
2
1Y  
1
1A  
4
1Z  
5
•
•
Thermal Shutdown Protection  
1,2EN  
8
Industry Standard Pinout, Compatible With  
SN75174, MC3487, DS96174, LTC487, and  
MAX3042  
2Y  
2Z  
9
2A  
6
12  
14  
3Y  
3Z  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
11  
15  
19  
3A  
3,4EN  
4A  
18  
16  
4Y  
4Z  
(2) The signaling rate of a line is the number of voltage  
transitions that are made per second, expressed in the unit  
bits per second (bps).  
DESCRIPTION/ORDERING INFORMATION  
The SN65LBC174A-EP is a quadruple differential line driver with 3-state outputs, designed for TIA/EIA-485  
(RS-485), TIA/EIA-422 (RS-422), and ISO 8482 applications.  
This device is optimized for balanced multipoint bus transmission at signaling rates up to 30-million bits per  
second (Mbps). The transmission media may be printed-circuit-board traces, backplanes, or cables. The ultimate  
rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise  
coupling to the environment.  
Each driver features current limiting and thermal-shutdown circuitry, making it suitable for high-speed multipoint  
applications in noisy environments. The device is designed using LinBiCMOS™ technology, facilitating low  
power consumption and robustness.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
LinBiCMOS is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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