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61AL5832D PDF预览

61AL5832D

更新时间: 2024-11-09 20:51:11
品牌 Logo 应用领域
SPECTRUM 电阻器
页数 文件大小 规格书
2页 116K
描述
RESISTOR, THIN FILM, 0.2W, 0.5%, 50ppm, 58300ohm, SURFACE MOUNT, 0303, CHIP

61AL5832D 技术参数

生命周期:Transferred包装说明:CHIP
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.57Is Samacsys:N
安装特点:SURFACE MOUNT端子数量:2
最高工作温度:150 °C封装形状:RECTANGULAR PACKAGE
包装方法:TRAY额定功率耗散 (P):0.2 W
额定温度:70 °C电阻:58300 Ω
电阻器类型:FIXED RESISTOR尺寸代码:0303
子类别:Fixed Resistors表面贴装:YES
技术:THIN FILM温度系数:50 ppm/ °C
端子形状:ONE SURFACE容差:0.5%
工作电压:100 VBase Number Matches:1

61AL5832D 数据手册

 浏览型号61AL5832D的Datasheet PDF文件第2页 
THIN FILM CHIP RESISTORS  
61 Series 0.030”x0.030”  
Satcon Electronics 61 series .030 x .030 Thin-film Resistor Chips are available in a wide range of resistances and  
tolerances. Values are available from 1.25 ohms to 1 megohm. Center-tapped resistors are standard for values up to  
500K. Applications include military and industrial hybrids, and medical, aerospace and communications equipment.  
61 series resistor chips are available with either passivated nichrome or tantalum-nitride resistor metalization. Nichrome  
provides excellent stability and temperature coefficient in hermetic applications while tantalum-nitride provides superior  
moisture-resistance for non-hermetic applications.  
Electrical Specifications  
Parameter  
Limit  
Test Conditions  
Power Rating  
Life  
Noise  
High Temp Exposure  
TCR (61AC, 61AL)  
TCR (61ACT)  
Operating voltage  
Moisture resistance  
Thermal shock  
200 mW  
+/-0.2% max  
-35 dB typ  
+/-0.2% max  
+/-50 ppm/C  
-50 to -120 ppm/C  
100 VDC max  
+/-0.5% max  
+/-0.5% max  
(derated at 70 deg. to 0 mW @ 150 deg.)  
1000 hours @ 125 degrees C  
MIL-STD-202 method 308  
100 hours at 150 degrees C  
-55 to 125 degrees C  
-55 to 125 degrees C  
MIL-STD-202 method 106  
MIL-STD-202 method 107  
Typical Configurations  
Mechanical Specifications  
Substrate  
Bond pad metalization  
Size  
Silicon with 1 micron thermal oxide  
Gold, 100 microinches  
.031 x .031 +/-.002 (0.78 x 0.78 mm +/- .05mm)  
0.013 +/-.003 (0.33 +/-0.07 mm)  
0.004 x .004 minimum (0.1 x 0.1 mm)  
0.6 microns SiO2 (61AC&61AL versions only)  
Lapped silicon  
Thickness  
Bond pad dimensions  
Protective overcoat (passivation)  
Back side  
SatCon Electronics Inc.  
Tel: 508-485-6350 Fax : 508-485-5168  
165 Cedar Hill Street, Marlborough, Ma 01752  
www.satconelectronics.com  

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