Datasheet > 597-10-316-10-005416

597-10-316-10-005416

更新时间： 2024-11-08 04:25:03

品牌	Logo	应用领域
仕元机械 - MILL-MAX		/
页数	文件大小	规格书
1页	141K
描述
IC Socket, BGA316, 316 Contact(s),

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

597-10-316-10-005416 数据手册

BALL GRID ARRAYS

For .050” Grid

Series 587, 582

Male Pin Adapters & Female Socket

• BGA adapter/socket systems are a reliable way to make BGAs pluggable,

they may also be used as a high density board-to-board interconnect.

• The BGA device is soldered to a 8737/4048 adapter

(or a 4098/4054 adapter is soldered to a PCB);

and then either one can be plugged into a 8214

surface mount socket.

• Both socket and adapter have the same footprint as

the BGA device.

• Insertion force is .40N per pin for standard pins 8737/4098.

Tapered EZ-IN pins 4048/4054 reduce insertion force to only

.08N, and are recommended for pin counts greater than 500.

A pry-bar tool (part #828-01-010) is available for extraction.

• Insulator material is FR-4 epoxy having a TCE to match the BGA device and

circuit board.

• Mill-Max offers the option of having the solder surfaces of the 4098/4054

adapters and 8214 socket pre-tinned.

BGA MOUNT ADAPTER PINS

Ordering Information

.034 DIA.

.018 DIA.

.034 DIA.

.016 DIA.

FOR BGA MOUNT ADAPTER PINS

.062

.068

Series

Plating

Window

Code

.127

STAN-

.013 DIA.

5 8 7

5 4 0

1 0

4 3 7

- -

DARD

STANDARD

PIN #8737

EZ-IN

PIN #4048

EZ-IN

4 4 8

1 0

- -

FOR PCB MOUNT STANDARD ADAPTER PIN

PCB MOUNT STANDARD

ADAPTER PIN #4098

.022 DIA.

.023

5 4 0

5 9 7

1 0

4 9 8

- -

.034 DIA.

.018 DIA.

.091

.127

.062

PRE-

TINNED

1 0

4 1 6

- -

FOR PCB MOUNT EZ-IN ADAPTER PIN

5 4 0

5 9 7

1 0

4 5 4

- -

Grid size

PCB MOUNT EZ-IN

PRE-

TINNED

ADAPTER PIN #4054

1 0

- -

4 3 0

.022 DIA.

.023

.034 DIA.

.016 DIA.

.091

.127

.062

No. of pins

Pattern #

Determined from footprint pattern pages 113 to 115

PLATING CODE XX=

Pin Plating

10µ” Au

.013 DIA.

FOR BGA FEMALE SOCKET

Series

Plating

Window

Code

SMT RECEPTACLE

TYPE #8214

5 8 2

5 9 5

1 1

4 1 4

4 2 6

.043 DIA.

- -

Grid size

.024

.062

PRE-

TINNED

.115

1 1

- -

.036 DIA.

.022 DIA.

.140

No. of pins

Pattern #

Determined from footprint pattern pages 113 to 115

SPECIFY PLATING CODE XX=

Sleeve (Pin)

10µ” Au

Contact (Clip)

www.mill-max.com

ꢀ

516-922-6000

112

中文翻译

下载PDF

与597-10-316-10-005416相关器件

型号	品牌	获取价格	描述	数据表
597-10-329-12-005416	MILL-MAX	获取价格	IC Socket, BGA329, 329 Contact(s),
597-10-329-12-005430	MILL-MAX	获取价格	IC Socket, BGA329, 329 Contact(s),
597-10-336-10-005430	MILL-MAX	获取价格	IC Socket, BGA336, 336 Contact(s),
597-10-336-10-007416	MILL-MAX	获取价格	IC Socket, BGA336, 336 Contact(s),
597-10-336-10-007430	MILL-MAX	获取价格	IC Socket, BGA336, 336 Contact(s),
597-10-352-13-005416	MILL-MAX	获取价格	IC Socket, BGA352, 352 Contact(s),
597-10-352-13-005430	MILL-MAX	获取价格	IC Socket, BGA352, 352 Contact(s),
597-10-357-09-005430	MILL-MAX	获取价格	IC Socket, BGA357, 357 Contact(s),
597-10-361-10-005416	MILL-MAX	获取价格	IC Socket, BGA361, 361 Contact(s),
597-10-416-14-005416	MILL-MAX	获取价格	IC Socket, BGA416, 416 Contact(s),

与597-10-316-10-005416相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

16
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

14
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

37
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

35

产品中心

服务支持

精选活动

关于我们

帮助中心

597-10-316-10-005416

597-10-316-10-005416 数据手册

与597-10-316-10-005416相关器件

与597-10-316-10-005416相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

597-10-316-10-005416

597-10-316-10-005416 数据手册

与597-10-316-10-005416相关器件

与597-10-316-10-005416相关文章

您还可以找

您在本页遇到什么问题？