生命周期: | Active | 零件包装代码: | QFP |
包装说明: | GQFF, TPAK228,2.5SQ,25 | 针数: | 228 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.05 |
CLB-Max的组合延迟: | 0.8 ns | JESD-30 代码: | S-CQFP-F228 |
JESD-609代码: | e4 | 长度: | 39.37 mm |
可配置逻辑块数量: | 3456 | 等效关口数量: | 661111 |
输入次数: | 162 | 逻辑单元数量: | 15552 |
输出次数: | 162 | 端子数量: | 228 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 661111 GATES | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | GQFF | 封装等效代码: | TPAK228,2.5SQ,25 |
封装形状: | SQUARE | 封装形式: | FLATPACK, GUARD RING |
电源: | 1.2/3.6,2.5 V | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
认证状态: | Qualified | 筛选级别: | MIL-PRF-38535 Class Q |
座面最大高度: | 3.0226 mm | 子类别: | Field Programmable Gate Arrays |
最大供电电压: | 2.625 V | 最小供电电压: | 2.375 V |
标称供电电压: | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | GOLD | 端子形式: | FLAT |
端子节距: | 0.635 mm | 端子位置: | QUAD |
宽度: | 39.37 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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