HCPL-5300, HCPL-5301, HCPL-530K, 5962-96852
Intelligent Power Module and Gate Drive
Interface Hermetically Sealed Optocouplers
Data Sheet
Description
Features
The HCPL-530X devices consist of a GaAsP LED optically
coupled to an integrated high gain photo detector in a
hermetically sealed package. The products are capable of
operation and storage over the full military temperature
range and can be purchased as either standard product
or with full MIL-PRF-38534 Class Level H or K testing or
from the DLA Drawing 5962-96852. All devices are man-
ufactured and tested on a MIL-PRF-38534 certified line
and are included in the DLA Qualified Manufacturers
List QML-38534 for Hybrid Microcircuits. Minimized pro-
pagation delay difference between devices make these
optocouplers excellent solutions for improving inverter
Performance specified over full military temperature
Range: -55° C to +125° C
Fast maximum propagation delays
t
t
= 450ns,
= 650ns
PHL
PLH
Minimized pulse width distortion (PWD = 450 ns)
High common mode rejection (CMR): 10kV/s at V
=
CM
1000 V
CTR > 30% at I = 10mA
F
1500 Vdc withstand test voltage
efficiency through reduced switching dead time. An on Manufactured and tested on a MIL-PRF-38534 certified
chip 20 k output pull-up resistor can be enabled by
shorting output pins 6 and 7, thus eliminating the need
for an external pull-up resistor in common IPM applica-
tions. Specifications and performance plots are given for
typical IPM applications.
line
Hermetically sealed packages
Dual marked with device part number and DLA
drawing number
QML-38534, Class H and K
Schematic Diagram
HCPL-4506 function compatibility
Applications
1
2
8
7
20 k
Military and space
High reliability systems
Harsh industrial environments
Transportation, medical, and life critical systems
IPM isolation
3
4
6
5
SHIELD
Isolated IGBT/MOSFET gate drive
AC and brushless DC motor drives
Industrial inverters
Truth Table
LED
ON
OFF
V
O
L
H
The connection of a 0.1 F bypass capacitor between pins 5 and 8 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.