Hermetically Sealed, High Speed,
High CMR, Logic Gate
Optocouplers
6N134*
81028
5962-98001
HCPL-268K
HCPL-563X HCPL-665X
HCPL-663X 5962-90855
HCPL-565X HCPL-560X
*See matrix for available extensions.
Technical Data
Features
• Line Receiver
Truth Table
(Positive Logic)
Multichannel Devices
• Dual Marked with Device
Part Number and DSCC
Drawing Number
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and K
• Five Hermetically Sealed
Package Configurations
• Performance Guaranteed
over -55°C to +125°C
• High Speed: 10 M Bit/s
• CMR: > 10,000 V/µs Typical
• 1500 Vdc Withstand Test
Voltage
• 2500 Vdc Withstand Test
Voltage for HCPL-565X
• High Radiation Immunity
• 6N137, HCPL-2601, HCPL-
2630/-31 Function
Compatibility
• Reliability Data
• TTL Circuit Compatibility
• Voltage Level Shifting
• Isolated Input Line Receiver
• Isolated Output Line Driver
• Logic Ground Isolation
• Harsh Industrial
Environments
• Isolation for Computer,
Communication, and Test
Equipment Systems
Input
On (H)
Off (L)
Output
L
H
Single Channel DIP
Input
Enable
Output
On (H)
Off (L)
On (H)
Off (L)
H
H
L
L
Description
H
H
H
These units are single, dual and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level H
or K testing or from the appropri-
ate DSCC Drawing. All devices are
manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DSCC Quali-
fied Manufacturers List QML-
38534 for Hybrid Microcircuits.
Quad channel devices are
L
Functional Diagram
Multiple Channel Devices
Available
V
CC
V
E
V
OUT
Applications
• Military and Space
• High Reliability Systems
• Transportation, Medical, and
Life Critical Systems
GND
available by special order in the
16 pin DIP through hole
packages.
The connection of a 0.1 µF bypass capacitor between VCC and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.