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54LVTH162244RPFB PDF预览

54LVTH162244RPFB

更新时间: 2024-02-21 17:16:18
品牌 Logo 应用领域
麦斯威 - MAXWELL 总线驱动器总线收发器逻辑集成电路信息通信管理
页数 文件大小 规格书
9页 216K
描述
16-Bit Buffers/Drivers with 3-State Outputs

54LVTH162244RPFB 技术参数

生命周期:Contact Manufacturer零件包装代码:DFP
包装说明:DFP,针数:48
Reach Compliance Code:unknown风险等级:5.08
系列:LVTJESD-30 代码:R-CDFP-F48
长度:15.748 mm逻辑集成电路类型:BUS DRIVER
位数:4功能数量:4
端口数量:2端子数量:48
最高工作温度:125 °C最低工作温度:-55 °C
输出特性:3-STATE WITH SERIES RESISTOR输出极性:TRUE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:DFP
封装形状:RECTANGULAR封装形式:FLATPACK
传播延迟(tpd):5.1 ns认证状态:Not Qualified
筛选级别:MIL-STD-883 Class S座面最大高度:3.8862 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:BICMOS温度等级:MILITARY
端子形式:FLAT端子节距:0.635 mm
端子位置:DUAL宽度:9.652 mm
Base Number Matches:1

54LVTH162244RPFB 数据手册

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54LVTH162244  
16-Bit Buffers/Drivers with  
3-State Outputs  
Logic Diagram  
FEATURES:  
DESCRIPTION:  
RAD-PAK® radiation-hardened against natural space radia-  
tion  
Maxwell Technologies’ 54LVTH162244 devices are 16-bit buff-  
ers and line drivers designed for low-voltage (3.3V) VCC oper-  
ation, but with the capability to provide a TTL interface to a 5V  
system environment. These devices can be used as four 4-bit  
buffers, two 8-bit buffers, or one 16-bit buffer. These devices  
provide true outputs and symmetrical active-low output-enable  
(OE) inputs.  
Total dose hardness:  
- > 100 krad (Si), depending upon space mission  
Output ports have equivalent 22-series resistors, so no  
external resistors are required  
Support mixed-mode signal operation (5V input and output  
voltages with 3.3V VCC  
)
Support unregulated battery operation down to 2.7V  
Typical VOLP (Output ground bounce) < 0.8V at VCC = 3.3V,  
TA = 25°C  
The outputs, which are designed to source or sink up to 12  
mA, include equivalent 22-series resistors to reduce over-  
shoot and undershoot. Active bus-hold circuitry is provided to  
hold unused or floating data inputs at a valid logic level.  
IOFF and power-up 3-state support hot insertion  
Bus hold on data inputs eliminates the need for external  
pull-up/pull-down resistors  
Maxwell Technologies' patented RAD-PAK® packaging technol-  
ogy incorporates radiation shielding in the microcircuit pack-  
age. It eliminates the need for box shielding while providing  
the required radiation shielding for a lifetime in orbit or space  
mission. In a GEO orbit, RAD-PAK provides greater than 100  
krad (Si) radiation dose tolerance. This product is available  
with screening up to Class S.  
Distributed VCC and GND pin configuration minimizes high-  
speed switching noise  
Flow-through architecture optimizes PCB layout  
Package: 48 pin RAD-PAK flat pack  
1000607  
12.19.01 Rev 1  
1
All data sheets are subject to change without notice  
(858) 503-3300 - Fax: (858) 4503-3301 - www.maxwell.com  
©2001 Maxwell Technologies.  
All rights reserved.  

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