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54F541

更新时间: 2024-02-25 00:16:54
品牌 Logo 应用领域
美国国家半导体 - NSC 驱动器
页数 文件大小 规格书
8页 168K
描述
Octal Buffer/Line Driver with TRI-STATE Outputs

54F541 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:20
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.37其他特性:WITH DUAL OUTPUT ENABLE
系列:F/FASTJESD-30 代码:R-CDIP-T20
逻辑集成电路类型:BUS DRIVER位数:8
功能数量:1端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE传播延迟(tpd):5 ns
认证状态:Not Qualified最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:TTL
温度等级:MILITARY端子形式:THROUGH-HOLE
端子位置:DUALBase Number Matches:1

54F541 数据手册

 浏览型号54F541的Datasheet PDF文件第2页浏览型号54F541的Datasheet PDF文件第3页浏览型号54F541的Datasheet PDF文件第4页浏览型号54F541的Datasheet PDF文件第5页浏览型号54F541的Datasheet PDF文件第6页浏览型号54F541的Datasheet PDF文件第7页 
May 1995  
54F/74F540 54F/74F541  
#
Octal Buffer/Line Driver with TRI-STATE Outputs  
É
General Description  
Features  
Y
TRI-STATE outputs drive bus lines  
The ’F540 and ’F541 are similar in function to the ’F240 and  
’F244 respectively, except that the inputs and outputs are  
on opposite sides of the package (see Connection Dia-  
grams). This pinout arrangement makes these devices es-  
pecially useful as output ports for microprocessors, allowing  
ease of layout and greater PC board density.  
Y
Inputs and outputs opposite side of package, allowing  
easier interface to microprocessors  
Package  
Commercial  
74F540PC  
Military  
Package Description  
Number  
N20A  
J20A  
20-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F540DM (Note 2)  
20-Lead Ceramic Dual-In-Line  
74F540SC (Note 1)  
74F540SJ (Note 1)  
M20B  
M20D  
W20A  
E20A  
N20A  
J20A  
20-Lead (0.300 Wide) Molded Small Outline, JEDEC  
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
54F540FM (Note 2)  
54F540LM (Note 2)  
20-Lead Cerpack  
20-Lead Ceramic Leadless Chip Carrier, Type C  
74F541PC  
20-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F541DM (Note 2)  
20-Lead Ceramic Dual-In-Line  
74F541SC (Note 1)  
74F541SJ (Note 1)  
M20B  
M20D  
W20A  
E20A  
20-Lead (0.300 Wide) Molded Small Outline, JEDEC  
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
54F541FM (Note 2)  
54F541LM (Note 2)  
20-Lead Cerpack  
20-Lead Ceramic Leadless Chip Carrier, Type C  
e
Note 1: Devices also available in 13 reel. Use suffix  
SCX and SJX.  
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix  
e
DMQB, FMQB and LMQB.  
Connection Diagrams  
Pin Assignment for  
DIP, SOIC and Flatpak  
’F540  
Pin Assignment  
for LCC  
TL/F/9553–2  
TL/F/9553–1  
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/9553  
RRD-B30M75/Printed in U. S. A.  

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