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54F540FM PDF预览

54F540FM

更新时间: 2024-09-29 22:36:35
品牌 Logo 应用领域
美国国家半导体 - NSC 总线驱动器总线收发器逻辑集成电路输出元件
页数 文件大小 规格书
8页 168K
描述
Octal Buffer/Line Driver with TRI-STATE Outputs

54F540FM 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:CERPACK-20Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.45
Is Samacsys:N其他特性:WITH DUAL OUTPUT ENABLE
控制类型:ENABLE LOW系列:F/FAST
JESD-30 代码:R-GDFP-F20JESD-609代码:e0
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.048 A位数:8
功能数量:1端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:INVERTED封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DFP封装等效代码:FL20,.3
封装形状:RECTANGULAR封装形式:FLATPACK
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
最大电源电流(ICC):75 mAProp。Delay @ Nom-Sup:11 ns
传播延迟(tpd):6 ns认证状态:Not Qualified
座面最大高度:2.286 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:TTL温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:FLAT
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:6.731 mm
Base Number Matches:1

54F540FM 数据手册

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May 1995  
54F/74F540 54F/74F541  
#
Octal Buffer/Line Driver with TRI-STATE Outputs  
É
General Description  
Features  
Y
TRI-STATE outputs drive bus lines  
The ’F540 and ’F541 are similar in function to the ’F240 and  
’F244 respectively, except that the inputs and outputs are  
on opposite sides of the package (see Connection Dia-  
grams). This pinout arrangement makes these devices es-  
pecially useful as output ports for microprocessors, allowing  
ease of layout and greater PC board density.  
Y
Inputs and outputs opposite side of package, allowing  
easier interface to microprocessors  
Package  
Commercial  
74F540PC  
Military  
Package Description  
Number  
N20A  
J20A  
20-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F540DM (Note 2)  
20-Lead Ceramic Dual-In-Line  
74F540SC (Note 1)  
74F540SJ (Note 1)  
M20B  
M20D  
W20A  
E20A  
N20A  
J20A  
20-Lead (0.300 Wide) Molded Small Outline, JEDEC  
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
54F540FM (Note 2)  
54F540LM (Note 2)  
20-Lead Cerpack  
20-Lead Ceramic Leadless Chip Carrier, Type C  
74F541PC  
20-Lead (0.300 Wide) Molded Dual-In-Line  
×
54F541DM (Note 2)  
20-Lead Ceramic Dual-In-Line  
74F541SC (Note 1)  
74F541SJ (Note 1)  
M20B  
M20D  
W20A  
E20A  
20-Lead (0.300 Wide) Molded Small Outline, JEDEC  
×
20-Lead (0.300 Wide) Molded Small Outline, EIAJ  
×
54F541FM (Note 2)  
54F541LM (Note 2)  
20-Lead Cerpack  
20-Lead Ceramic Leadless Chip Carrier, Type C  
e
Note 1: Devices also available in 13 reel. Use suffix  
SCX and SJX.  
×
Note 2: Military grade device with environmental and burn-in processing. Use suffix  
e
DMQB, FMQB and LMQB.  
Connection Diagrams  
Pin Assignment for  
DIP, SOIC and Flatpak  
’F540  
Pin Assignment  
for LCC  
TL/F/9553–2  
TL/F/9553–1  
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.  
C
1995 National Semiconductor Corporation  
TL/F/9553  
RRD-B30M75/Printed in U. S. A.  

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