5秒后页面跳转
| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 53324-0460 | MOLEX |
获取价格 |
2.00mm (.079") Pitch Mi ll™ System Wire-to-Bo |
|
| 53324-0464 | MOLEX |
获取价格 |
Board Connector, 4 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal |
|
| 53324-0513 | MOLEX |
获取价格 |
Board Connector, 5 Contact(s), 1 Row(s), Male, Straight, Solder Terminal |
|
| 53324-0560 | MOLEX |
获取价格 |
2.00mm (.079") Pitch Mi ll™ System Wire-to-Bo |
|
| 53324-0562 | MOLEX |
获取价格 |
Board Connector, 5 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal |
|
| 53324-0564 | MOLEX |
获取价格 |
Board Connector, 5 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal |
|
| 53324-0612 | MOLEX |
获取价格 |
Board Connector, 6 Contact(s), 1 Row(s), Male, Straight, Solder Terminal |
|
| 53324-0613 | MOLEX |
获取价格 |
Board Connector, 6 Contact(s), 1 Row(s), Male, Straight, Solder Terminal |
|
| 53324-0614 | MOLEX |
获取价格 |
Board Connector, 6 Contact(s), 1 Row(s), Male, Straight, Solder Terminal |
|
| 53324-0660 | MOLEX |
获取价格 |
2.00mm (.079") Pitch Mi ll™ System Wire-to-Bo |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
工作时间：9:00-21:00
CEO邮箱：ceo@jiepei.com
投诉邮箱：tousu@jiepei.com
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
