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| 5-794632-0 | MACOM |
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VERTICAL HEADER ASSEMBLY, THRU HOLE, 30 GOLD, DUAL ROW, MICRO MATE-N-LOK |
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| 5-794632-0 | TE |
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英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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