1.27 by 1.27mm
FEATURES AND SPECIFICATIONS
(.050 by .050”) Pitch
SEARAY* Connector
The SEARAY connector accommodates low-profile applications with stack heights of 7.00 to
15.00mm (.276 to .591”) for the large and growing, high-density, high-performance mezzanine
connector market
45970 Plug
45971 Receptacle
The SEARAY board-to-board connector is designed for
applications with high pin-count devices or memory
modules that are mounted on mezzanine or module
PCBs. The unique, Molex-patented, solder-charge
technology results in better process yields and a lower-
applied cost versus equivalent Ball Grid Array (BGA)
connector products. Solder-charge technology is a
patented Molex process, which provides optimized PCB
adhesion and immense mechanical retention force.
The SEARAY connector provides numerous benefits.
It allows customers to simplify PCB routing without
sacrificing performance. Customers will avoid the
expense of large, complex, multi-layer boards and
utilize space better within a given card slot area.
Option cards may be added or upgraded to increase
flexibility in design, production and testing. The
SEARAY connector design has superior electrical and
mechanical features that are cost competitive. For
additional information, please visit: www.molex.com/
product/searay.html.
SEARAY mezzanine solutions pack many high-speed signals
in very dense spaces with stack heights of 7.00 to 15.00mm
(.276 to .591”)
Features and Benefits
n Molex’s unique and patented, solder- attach method n Popular footprint is compatible with other products
is more cost effective and reliable than BGA attach
methods
in the market: 1.27 by 1.27mm (.050 by .050”);
and allows ease in multiple sourcing with other
common products
n Data rates of up to 10Gbps have excellent
signal clarity and large bandwidth for customer
requirements in high-speed designs
n Robust contact design prevents stubbing and
damage in mating interface
n Flexible tooling design with multiple stack heights
and circuit sizes provides ease in tooling a new
circuit size or stack-height version
SPECIFICATIONS
Reference Information
Product Specification: PS-45970-001
Packaging: Tray
UL File No.: TBD
CSA File No.: TBD
Mechanical
Mating Force: 50g max. per contact
Un-mating Force: 30g max. per contact
Normal Force: 82g max. per contact
Durability: 100 cycles
Designed in: Inches
Physical
Electrical
Voltage: 250V AC per contact
Current: 1.0A per contact
Housing: Glass-filled LCP, UL 94V-0
Contact: Copper (Cu) Alloy
Plating:
Contact Resistance: 25 milliohms nominal
Dielectric Withstanding Voltage: 500V DC
Insulation Resistance: 5000 Megohms min.
Contact Area – 0.75µm Gold (Au) min.
Solder Tail Area – 3.80µm Tin (Sn) min.
Underplating – 1.25µm Nickel (Ni) min. overall
Operating Temperature: -55 to +105°C
*SEARAY is a trademark of Samtec, Inc.