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450-0152C

更新时间： 2024-09-24 00:54:31
品牌 Logo 应用领域
LSTD 局域网WLAN无线局域网电信电信集成电路
页数 文件大小 规格书
66页 1784K
描述
Integrated 802.11 b/g/n WLAN, Bluetooth & BLE Module

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450-0152C 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：CHIP ANTENNA MODULE-47Reach Compliance Code：unknown
风险等级：2.22JESD-30 代码：R-XXMA-N47
长度：21 mm湿度敏感等级：4
功能数量：1端子数量：47
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：UNSPECIFIED封装形状：RECTANGULAR
封装形式：MICROELECTRONIC ASSEMBLY峰值回流温度（摄氏度）：245
座面最大高度：2.14 mm标称供电电压：3.3 V
表面贴装：YES电信集成电路类型：TELECOM CIRCUIT
温度等级：INDUSTRIAL端子形式：NO LEAD
端子位置：UNSPECIFIED处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：15.5 mmBase Number Matches：1

450-0152C 数据手册

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Sterling-LWB Module  
Datasheet  
Integrated 802.11 b/g/n WLAN, Bluetooth & BLE Module  
FEATURES  
DESCRIPTION  
The Sterling-LWB is a high performance 2.4 GHz  
WLAN and Bluetooth combo module based on  
latest-generation silicon (Broadcom’s BCM4343W).  
With an industrial temperature rating, broad  
country certifications, and the availability of three  
different package styles, the Sterling-LWB provides  
significant flexibility to meet various end user  
application needs.  
•
•
IEEE 802.11 b/g/n (single stream n)  
Typical WLAN Transmit Power:  
o
o
o
+17.5 dBm, 11 Mbps, CCK (b)  
+14.0 dBm, 54 Mbps, OFDM (g)  
+12.5 dBm, HT20 MCS7 (n)  
•
Typical WLAN Sensitivity:  
o
o
o
-88 dBm, 8% PER,11 Mbps (b)  
-75 dBm, 10% PER, 54 Mbps (g)  
-72 dBm, 10% PER, MCS7 (n)  
The on-module chip antenna package style for the  
Sterling-LWB eliminates complexity for design  
integration, simplifies manufacturing assembly with  
larger pin outs, and features an advanced chip  
antenna that offers greater resistance to de-tuning  
than typical trace or chip antennas.  
•
•
•
Bluetooth v4.2 BR /DR/LE  
WLAN and Bluetooth coexistence  
Available in two footprint styles:  
o Easy to Integrate: 15.5 mm x 21 mm  
o Miniature footprint: 10 mm x 10 mm  
Available with integrated chip antenna or  
U.FL connector for external antenna  
Operating voltage: 3.0V to 3.6V  
Operating temperature: -40o to +85o C  
Storage temperature: -40° to +125°C  
Compact design based on Broadcom  
BCM4343W SoC  
•
•
•
•
•
•
Worldwide acceptance: FCC (USA), IC  
(Canada), ETSI (Europe), Giteki (Japan), and  
RCM (AU/NZ)  
BT SIG QDID: 85005  
REACH and RoHS compliant  
The module includes the MAC, Baseband and Radio  
to support WLAN applications and an independent,  
high-speed UART is provided for the Bluetooth host  
interface. In addition, the latest Linux and Android  
drivers are supported directly by LSR and  
Broadcom.  
•
APPLICATIONS  
•
•
•
Security & Building Automation  
Internet of Things / M2M Connectivity  
Smart Gateways  
Need to get to market quickly? Not an expert in  
802.11. Need a custom antenna? Would you like to  
own the design? Would you like a custom design?  
Not quite sure what you need? Do you need help  
with your host board? LSR Design Services will be  
happy to develop custom hardware or software or  
assist with integrating the design. Contact us at  
sales@lsr.com or call us at 262-375-4400.  
The information in this document is subject to change without notice.  
330-0190-R7.1 Copyright © 2016-2018 LSR  
Page 1 of 66  
 
 
 
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