Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
621 AND 623 SERIES
Low-Profile Heat Sinks for All Metal-Case Power Semiconductors
TO-3
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Height
in. (mm)
Mounting
Hole Pattern
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
621A
621K
623A
623K
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 3.000 (76.2)
4.750 (120.6) x 3.000 (76.2)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
(1) TO-3
None
(1) TO-3
None
75°C @ 15W
75°C @ 15W
52°C @ 15W
52°C @ 15W
2.0°C/W @ 250 LFM
2.0°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
0.1000 (45.36)
0.1000 (45.36)
0.2100 (95.26)
0.210O (95.26)
A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case
power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find
a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.)
in width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the
standard TO-3 package. Material: Aluminum Alloy, Black Anodized.
621 AND 623 SERIES (EXTRUSION PROFILE 1327)
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
A
K
Dimensions: in. (mm)
301/302/303 SERIES
Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases
STUD-MOUNT
Outline
Dimensions
in. (mm)
Mounting
Hole (s)
Pattern and Number
Thermal Performance at Typical Load
Standard
P/N
Length “A”
in. (mm)
Natural
Forced
Weight
lbs. (grams)
Convection
Convection
301K
301M
301N
302M
302MM
302N
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
0.750 (19.1)
None
70°C @ 15W
70°C @ 15W
70°C @ 15W
50°C @ 15W
50°C @ 15W
5O°C @ 15W
50°C @ 15W
37°C @ 15W
37°C @ 15W
37°C @ 15W
37°C @ 15W
2.5°C/W @ 250 LFM
2.5°C/W @ 250 LFM
2.5°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
0.0580 (26.31)
0.0580 (26.31)
0.0580 (26.31)
0.1330 (60.33)
0.1330 (6033)
0.1330 (60.33)
0.1330 (60.33)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth
0.750 (19.1) (1) 1⁄
4
-28UNF, 0.625 in. thread depth
1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth
1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth
1.500 (38.1) (1) 1⁄
4
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
302NN ̆ 2.000 (50.8) x 2.000 (50.8)
303M 2.000 (50.8) x 2.000 (50.8)
303MM 2.000 (50.8) x 2.000 (50.8)
303N ̆ 2.000 (50.8) x 2.000 (50.8)
303NN
1.500 (38.1) (2) 1⁄
4
3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth
3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth
3.000 (76.2) (1) 1⁄
3.000 (76.2) (2)
4
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
1
2.000 (50.8) x 2.000 (50.8)
⁄
4
The large fin area in minimum total volume provided by the radial design of the 301/302/303
Series offers maximum heat transfer efficiency in natural convection. All types are available
with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the
302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and
“NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black
Anodized.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL
DIMENSIONS
SEMICONDUCTOR MOUNTING HOLES
K
M
N
302 AND 303 SERIES
SERIES
301
302
303
Dimensions: in. (mm)
301 SERIES
641 SERIES
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
TO-3
Outline
Dimensions
in. (mm)
Mounting
Hole
Pattern
Thermal Performance at Typical Load
Standard
P/N
Height
in. (mm)
Natural
Forced
Weight
lbs. (grams)
Convection
Convection
641A ̆
641K ̆
4.125 (104.8) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
1.000 (25.4)
1.000 (25.4)
(1) TO-3
None
36°C @ 15W
36°C @ 15W
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
0.2900 (131.54)
0.2900 (131.54)
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
tion with an optimized heat sink surface area. The 641K type with an open channel area of
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black
Anodized.
641 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL
DIMENSIONS
(EXTRUSION PROFILE 1371)
SEMICONDUCTOR MOUNTING HOLES
A
K
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
50
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