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4116T-2-2222DBB

更新时间： 2024-11-17 12:35:15
品牌 Logo 应用领域
伯恩斯 - BOURNS 电阻器网络
页数 文件大小 规格书
62页 1878K
描述
Resistor Networks Product Selection Guide

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4116T-2-2222DBB 数据手册

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w w w . b o u r n s  
. c o m  
Resistor Networks  
I.  
Product Selection Guide...........................................................278  
II. Popular Resistance Codes........................................................284  
III. Thick Film Products  
Through-hole Packages  
Molded DIPs...................................................................286  
Molded SIPs...................................................................288  
Conformal SIPs ..............................................................294  
Surface Mount Packages  
For a complete listing of thick film products  
in stock and readily available through distri-  
bution, see page 284.  
Wide Body......................................................................300  
Medium Body.................................................................302  
Ordering Guide...............................................................304  
RC Networks  
T-Filters (EMI/RFI Low-Pass Filters)...............................305  
RC Terminators ..............................................................307  
ECL Terminators .............................................................309  
Capacitor Networks ........................................................312  
IV. Precision Thin-Film-on-Ceramic Products  
Through-hole Packages ......................................................313  
Surface Mount Packages ....................................................318  
VI. Designer’s Guide and Application Notes  
EMI/RFI Filters................................................................320  
RC Terminator Networks ................................................322  
Emitter Coupled Logic Terminators ................................324  
Dual Terminator Resistor Networks................................326  
SCSI ...............................................................................327  
R/2R Ladder Networks ...................................................330  
DRAM Applications ........................................................331  
Thin Film Applications ....................................................334  
Soldering and Cleaning Processes .................................336  
Specifications are subject to change without notice.  
277  
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