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4116R-001-332 PDF预览

4116R-001-332

更新时间: 2024-11-01 12:54:23
品牌 Logo 应用领域
伯恩斯 - BOURNS 电阻器网络阵列电阻器网络电阻器
页数 文件大小 规格书
62页 1878K
描述
Resistor Networks Product Selection Guide

4116R-001-332 技术参数

是否Rohs认证:不符合生命周期:Obsolete
包装说明:,Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8533.21.00.60
风险等级:5.7Is Samacsys:N
构造:Molded元件功耗:0.25 W
第一元件电阻:3300 ΩJESD-609代码:e0
引线长度:3.43 mm引线间距:2.54 mm
安装特点:THROUGH HOLE MOUNT网络类型:ISOLATED
元件数量:1功能数量:8
端子数量:16最高工作温度:125 °C
最低工作温度:-55 °C封装高度:4.57 mm
封装长度:21.97 mm封装形状:RECTANGULAR PACKAGE
封装形式:DIP封装宽度:6.71 mm
额定功率耗散 (P):2.25 W额定温度:70 °C
电阻:3300 Ω电阻器类型:ARRAY/NETWORK RESISTOR
表面贴装:NO技术:METAL GLAZE/THICK FILM
温度系数:100 ppm/ °C温度系数跟踪:50 ppm/ °C
端子面层:Tin/Lead (Sn/Pb)端子形状:FLAT
容差:2%工作电压:100 V
Base Number Matches:1

4116R-001-332 数据手册

 浏览型号4116R-001-332的Datasheet PDF文件第2页浏览型号4116R-001-332的Datasheet PDF文件第3页浏览型号4116R-001-332的Datasheet PDF文件第4页浏览型号4116R-001-332的Datasheet PDF文件第5页浏览型号4116R-001-332的Datasheet PDF文件第6页浏览型号4116R-001-332的Datasheet PDF文件第7页 
w w w . b o u r n s  
. c o m  
Resistor Networks  
I.  
Product Selection Guide...........................................................278  
II. Popular Resistance Codes........................................................284  
III. Thick Film Products  
Through-hole Packages  
Molded DIPs...................................................................286  
Molded SIPs...................................................................288  
Conformal SIPs ..............................................................294  
Surface Mount Packages  
For a complete listing of thick film products  
in stock and readily available through distri-  
bution, see page 284.  
Wide Body......................................................................300  
Medium Body.................................................................302  
Ordering Guide...............................................................304  
RC Networks  
T-Filters (EMI/RFI Low-Pass Filters)...............................305  
RC Terminators ..............................................................307  
ECL Terminators .............................................................309  
Capacitor Networks ........................................................312  
IV. Precision Thin-Film-on-Ceramic Products  
Through-hole Packages ......................................................313  
Surface Mount Packages ....................................................318  
VI. Designers Guide and Application Notes  
EMI/RFI Filters................................................................320  
RC Terminator Networks ................................................322  
Emitter Coupled Logic Terminators ................................324  
Dual Terminator Resistor Networks................................326  
SCSI ...............................................................................327  
R/2R Ladder Networks ...................................................330  
DRAM Applications ........................................................331  
Thin Film Applications ....................................................334  
Soldering and Cleaning Processes .................................336  
Specifications are subject to change without notice.  
277  

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