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3VD060060NEJL

更新时间: 2024-09-25 06:26:51
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士兰微 - SILAN /
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描述
NCH MOSFET CHIPS WITH ESD PROTECTED STRUCTURE

3VD060060NEJL 数据手册

  
3VD060060NEJL  
3VD060060NEJL N•CH MOSFET CHIPS WITH ESD PROTECTED STRUCTURE  
DESCRIPTION  
Ø
3VD060060JL is a N•Channel enhancement mode  
MOS•FET chip fabricated in advanced silicon epitaxial  
planar technology.  
Ø
Ø
Ø
Ø
Ø
Ø
Zener diode ESD protected up to 2KV  
High density cell design for lowDSR(ON)  
Rugged and reliable.  
Fast switching performance.  
High saturation current capability.  
The chips may be packaged in SOT•23 type and the  
typical equivalent product is 2N7002K.  
The packaged product is widely used in the small servo  
motor control, power MOS•FET gate drivers, and other  
switching applications.  
CHIP TOPOGRAPHY  
Ø
Ø
Ø
Ø
Die size: 0.60mm*0.60mm.  
Chip Thickness: 230±m2m0.  
Top metal : Al, Backside Metal : Au.  
EQUIVALENT CIRCUIT  
ABSOLUTE MAXIMUM RATINGS (Tamb=25°C)  
Parameter  
Drain•Source Voltage  
Gate•Source Voltage  
Drain Current  
Symbol  
VDS  
VGS  
ID  
Ratings  
Unit  
V
60  
±20  
V
300  
mA  
mW  
°C  
Power Dissipation (SOT•23)  
Operation Junction Temperature  
Storage Temperature  
PD  
350  
TJ  
150  
•55•150  
°C  
Tstg  
ELECTRICAL CHARACTERISTICS (Tamb=25°C)  
Parameter  
Symbol  
Test conditions  
VGS=0V, ID=10µA  
Min  
60  
1
Typ  
••  
Max  
••  
Unit  
Drain•Source Breakdown Voltage V(BR)DSS  
V
••  
Gate•Threshold Voltage*  
Gate•body Leakage  
Vth(GS)  
lGSS  
VDS= VGS, ID=250µA  
VDS=0V, VGS =±20V  
VDS=60V, VGS =0V  
VGS=10V, ID=500mA  
VGS=5V, ID=50mA  
2.5  
±10  
1
••  
••  
µA  
µA  
••  
••  
Zero Gate Voltage Drain Current  
IDSS  
••  
••  
2.0  
3.0  
Drain•Source On•Resistance*  
RDS(on)  
Ÿ
••  
••  
Note:* Pulse test, pulse width”300µS, duty cycle”2%  
HANGZHOU SILAN MICROELECTRONICS CO.,LTD  
Http: www.silan.com.cn  
REV:1.0  
2007.09.03  
Page 1 of 1  

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