3SMAJ5913B
THRU
3SMAJ5943B
M C C
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
TM
Micro Commercial Components
Features
3.0 Watt
Surface Mount
Silicon
ꢀ
ꢀ
ꢀ
Surface Mount Application
3.3 thru 56 Volt Voltage Range
Low Inductance,Low Profile Mounting
ꢀ
ꢀ
Glass Passivated Junction
High specified maximum current (IZM) when adequately heat sinking
Zener Diodes
ꢀ
Mechanical Data
DO-214AC
ꢀ
Case Material: Molded Plastic. UL Flammability
ꢀ
(SMA) (LEAD FRAME)
ꢀ
Classification Rating 94V-0
ꢀ
ꢀ
ꢀ
ꢀ
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
H
ꢀ
ꢀ
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 2600C for 10 seconds.
J
Maximum Ratings @ 25oC Unless Otherwise Specified
A
C
E
Maximum
VF
D
B
F
1.5V
(Note: 1)
(Note: 2)
Forward
Voltage
G
Steady State
Pd
3.0W
DIMENSIONS
Power
INCHES
MIN
.079
.050
.002
---
MM
MIN
2.00
1.27
.05
Dissipation
DIM
A
MAX
MAX
2.44
1.63
.20
NOTE
Operation and
Storage
Temperature
TJ, TSTG -55oC to
.096
.064
.008
.02
B
+150oC
C
D
E
---
.51
.030
.065
.189
.157
.090
.060
.091
.220
.181
.115
.76
1.52
2.32
5.59
4.60
2.92
F
1.65
4.80
4.00
2.25
G
H
J
Thermal
25R/W
Resistance
Junction to Lead
RthJL
SUGGESTED SOLDER
PAD LAYOUT
0.085 ”
MAX
NOTES:
1.
2.
Forward Current @ 200mA.
0.058 ”
Mounted on 5.0mm2 (.013mm thick) Iand areas.
Lead temperature at TL=75oC
MIN
0.05
MIN
www.mccsemi.com
Revision: 3
2007/04/19
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