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3MBI150UC-120 PDF预览

3MBI150UC-120

更新时间: 2024-09-27 02:52:47
品牌 Logo 应用领域
富士电机 - FUJI /
页数 文件大小 规格书
5页 128K
描述
1200V / 150A 3 in one-package

3MBI150UC-120 技术参数

生命周期:Obsolete零件包装代码:MODULE
包装说明:FLANGE MOUNT, R-XUFM-X39针数:39
Reach Compliance Code:unknown风险等级:5.83
外壳连接:ISOLATED最大集电极电流 (IC):200 A
集电极-发射极最大电压:1200 V配置:COMMON COLLECTOR, 3 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR
JESD-30 代码:R-XUFM-X39元件数量:3
端子数量:39封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:NO端子形式:UNSPECIFIED
端子位置:UPPER晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):370 ns
标称接通时间 (ton):360 nsBase Number Matches:1

3MBI150UC-120 数据手册

 浏览型号3MBI150UC-120的Datasheet PDF文件第2页浏览型号3MBI150UC-120的Datasheet PDF文件第3页浏览型号3MBI150UC-120的Datasheet PDF文件第4页浏览型号3MBI150UC-120的Datasheet PDF文件第5页 
3MBI150UC-120  
1200V / 150A 3 in one-package  
IGBT Module U-Series  
Features  
Applications  
· High speed switching  
· Inverter for Motor drive  
· Voltage drive  
· AC and DC Servo drive amplifier  
· Uninterruptible power supply  
· Low inductance module structure  
· With shunt resistors  
· Industrial machines, such as Welding machines  
Maximum ratings and characteristics  
Absolute maximum ratings (at Tc=25°C unless otherwise specified)  
Conditions  
Rating  
1200  
Unit  
V
Item  
Symbol  
VCES  
VGES  
IC  
Collector-Emitter voltage  
Gate-Emitter voltaga  
Collector current  
±20  
200  
V
Continuous  
1ms  
A
Tc=25°C  
Tc=80°C  
Tc=25°C  
Tc=80°C  
150  
400  
ICp  
300  
150  
-IC  
300  
-IC pulse  
PC  
1 device  
AC:1min.  
735  
W
°C  
Collector Power Dissipation  
+150  
-40 to +125  
2500  
3.5  
Junction temperature  
Tj  
Storage temperature  
Tstg  
VAC  
N·m  
Isolation voltage between terminal and copper base *1  
Viso  
Screw Torque  
Mounting *2  
*1 : All terminals should be connected together when isolation test will be done.  
*2 : Recommendable value : 2.5 to 3.5 N·m(M5)  
Electrical characteristics (at Tj=25°C unless otherwise specified)  
Item  
Symbols Conditions  
Characteristics  
Unit  
Min.  
Typ.  
Max.  
Zero gate voltage collector current  
Gate-Emitter leakage current  
VGE=0V, VCE=1200V  
mA  
nA  
V
ICES  
IGES  
VGE(th)  
VCE(sat)  
(chip)  
Cies  
4.5  
1.0  
200  
8.5  
VCE=0V, VGE=±20V  
VCE=20V, IC=150mA  
VGE=15V, IC=150A  
Gate-Emitter threshold voltage  
Collector-Emitter saturation voltage  
6.5  
1.75  
2.00  
V
2.10  
Tj=25°C  
Tj=125°C  
Input capacitance  
Turn-on time  
VCE=10V, VGE=0V, f=1MHz  
nF  
µs  
17  
VCC=600V  
ton  
0.36  
0.21  
0.03  
0.37  
0.07  
1.60  
1.70  
1.20  
0.60  
IC=150A  
tr  
VGE=±15V  
tr(i)  
Turn-off time  
RG=2.2  
toff  
1.00  
0.30  
1.90  
tf  
Tj=25°C  
Tj=125°C  
Forward on voltage  
VGE=0V  
IF=150A  
IF=150A  
V
VF  
(chip)  
trr  
Reverse recovery time  
Lead resistance, terminal-chip*3  
Shunt resistance  
µs  
0.35  
Without shunt resistance  
Resistance of R1 to R6 *4  
mΩ  
R lead  
R shunt  
5.1  
2.4  
*3: Biggest internal terminal resistance among arm.  
*4 R1 to R2 is shown in equivalent circuit (p5)  
Thermal resistance characteristics  
Items  
Symbols  
Conditions  
Characteristics  
Min. Typ.  
Unit  
Max.  
0.17  
0.28  
IGBT  
Thermal resistance  
Rth(j-c)  
°C/W  
FWD  
Rth(j-c)  
°C/W  
°C/W  
0.05  
With thermal compound  
Contact Thermal resistance  
Rth(c-f)*5  
*5 : This is the value which is defined mounting on the additional cooling fin with thermal compound.  

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