3DFR0.3A~3DFR0.3M
Surface Mount Fast Recovery Rectifiers
Features
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Low profile space
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Ideal for automated placement
Glass passivated chip junctions
Low forward voltage drop
Pb
Low leakage current
High forward surge capability
High temperature soldering:
260℃/10 seconds at terminals
Major Ratings and Characteristics
IF(AV)
VRRM
IFSM
0.3A
50 V to 1000 V
10 A
Mechanical Date
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Case: SOD-323 molded plastic
body over glass passivated chip
IR
5 μA
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Terminals: Solder plated, solderable per
VF
1.3 V
JESD22-B102
Tj max.
150 °C
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Polarity: Laser band denotes cathode end
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Weight: 0.0063gram
Maximum Ratings & Thermal Characteristics
(TA = 25 °C unless otherwise noted)
3DFR 3DFR 3DFR 3DFR 3DFR 3DFR 3DFR
0.3A 0.3B 0.3D 0.3G 0.3J 0.3K 0.3M
Items
Symbol
UNIT
VRRM
VRMS
VDC
Maximum repetitive peak reverse voltage
Maximum RMS voltage
50
35
50
100
70
200
140
200
400
280
400
0.3
600
420
600
800
560
800
1000
700
V
V
V
A
Maximum DC blocking voltage
100
1000
IF(AV)
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
IFSM
10
35
A
℃/ W
℃
(1)
RθJL
Thermal resistance from junction to lead
Operating junction and storage temperature
range
TJ,TSTG
–55 to +150
Note 1: Mounted on P.C.B. with 0.036 x 0.06” (0.9 x 1.5mm) copper pad areas.
(TA = 25 °C unless otherwise noted)
Electrical Characteristics
Items
Test conditions
Symbol 3DFR0.3A~0.3G 3DFR0.3J 3DFR0.3K~0.3M UNIT
Instantaneous forward
voltage
IF=0.3A(2)
VF
IR
1.3
V
Tj=25℃
Tj=125℃
IF=0.5A IR=1A,
Irr=0.25A
5
VR=VDC
Maximum reverse current
Reverse recovery time
μA
nS
50
trr
150
250
500
Note 2: Pulse test:300μs pulse width,1% duty cycle.
http://www.trr-jx.com
version: 02