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8468-21A1-RK-TR PDF预览

8468-21A1-RK-TR

更新时间: 2024-01-15 03:07:08
品牌 Logo 应用领域
3M 插座插槽和芯片载体
页数 文件大小 规格书
3页 812K
描述
3M™ Chip Carrier Sockets

8468-21A1-RK-TR 技术参数

是否Rohs认证:符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8536.69.40.40风险等级:5.62
Is Samacsys:N其他特性:STANDARD: UL 94V-0
联系完成配合:MATTE TIN (160) OVER NICKEL (50)触点材料:PHOSPHOR BRONZE
设备插槽类型:IC SOCKET外壳材料:GLASS FILLED POLYPHENYLENE SULFIDE
触点数:68Base Number Matches:1

8468-21A1-RK-TR 数据手册

 浏览型号8468-21A1-RK-TR的Datasheet PDF文件第2页浏览型号8468-21A1-RK-TR的Datasheet PDF文件第3页 
3MChip Carrier Sockets  
Surfacemount  
8400 Series  
•ꢀ Accepts chip carriers conforming to JEDEC outline  
MO-047 for square and MO-052 for rectangular  
•ꢀ High temperature insulator compatible with IR reflow  
and wave soldering  
•ꢀ Compatible with automated loading equipment  
•ꢀ Open top design allows unrestricted air flow  
•ꢀ Molded slots for ease of device extraction  
•ꢀ Available with optional PCB locating posts  
•ꢀ RoHS Compliant. See the Regulatory Information  
Appendix (RIA) in the "RoHS Compliance" section  
of www.3Mconnector.com for compliance  
information (RIA E1 and C1 apply)  
Date Modified: September 14, 2011  
TS-2147-B  
Sheet 1 of 2  
Physical  
Insulation  
Material: Glass Filled Polyphenylene Sulfide (PPS)  
Flammability: UL 94V-0  
Color: Black  
Contact  
Material:  
CopperAlloy  
Plating  
Underplating: 50 µ" [ 1.27 µm ] Nickel - Overall  
WipingArea: 160 µ", [ 4.06 µm ] Matte Tin  
Electrical  
Contact Resistance: 15 mΩ  
Insulation Resistance: >103 MΩ minimum  
<1 pF at 1 MHz  
Capacitance:  
Environmental  
-40ºC to +105ºC  
Temperature Rating:  
Maximum 260°C, single pass, (profile per J-STD-020C)  
1 (per J-STD-020C)  
Process Rating:  
Moisture Sensitivity Level:  
Notice:  
Please be aware that the 3M PLCC products are tin plated on the contact wiping surface. This is necessary to ensure mated reliability since standard PLCC contacts are also tin plated. Since tin  
whiskers are an inherent characteristic of tin and mechanically stressing the tin is a known driver of whisker growth, it is possible the PLCC and PLCC socket may exhibit tin whisker growth after  
mating. 3M follows the iNEMI plating recommendations which include whisker mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Please consider whether a PLCC  
socket is suitable for your particular needs after considering your product applications life span and environment including mechanical stresses, humidity, and thermal cycling all of which have  
been shown to stimulate tin whisker growth.  
3
3M is a trademark of 3M Company.  
For technical, sales or ordering information call  
Electronic Solutions Division  
Interconnect Solutions  
800-225-5373  
http://www.3Mconnectors.com  

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