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39-53-6269

更新时间： 2024-11-07 10:26:19
品牌 Logo 应用领域
莫仕 - MOLEX /
页数 文件大小 规格书
1页 125K
描述
Board Connector, 26 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal, LEAD FREE

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中文翻译

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39-53-6269 数据手册

  
Features and Benefits  
Electrical  
2.54mm (.100") Pitch  
QF-50™  
■
Voltage:ꢀ250V  
ꢀ 10ꢀtoꢀ64ꢀcircuits  
■
■
■
■
■
Current:ꢀ1.0A  
ꢀ Tinꢀplatedꢀonꢀsolderꢀtail  
ꢀ CompliesꢀwithꢀindustryꢀstandardꢀDINꢀ41654  
ꢀ Polarized  
ꢀ SelectiveꢀGoldꢀplatingꢀoptionsꢀforꢀcontacts  
ꢀ Ejectꢀleversꢀallowꢀend-to-endꢀstackingꢀwithꢀorꢀwithoutꢀ  
strainꢀreliefꢀwithꢀnoꢀlossꢀofꢀboardꢀspace  
ContactꢀResistance:ꢀ20ꢀmilliohmsꢀmax.  
DielectricꢀWithstandingꢀVoltage:ꢀ500V  
InsulationꢀResistance:ꢀ1000ꢀMegohmsꢀmin.  
Shrouded Header  
5576  
Vertical  
With Eject Levers  
Physical  
Housing:ꢀGlass-filledꢀPBTP  
Contact:ꢀBrass  
Reference Information  
Packaging:ꢀTray  
OperatingꢀTemperature:ꢀ-40ꢀtoꢀ+105˚C  
DesignedꢀIn:ꢀMillimeters  
MatesꢀWith:ꢀ5320  
G
Order No.  
Order No.  
Circuits  
Lead-free  
Circuits  
Lead-free  
Plating NBGS1  
39-27-1103  
39-27-1143  
39-27-1163  
39-27-1203  
39-27-1263  
39-27-1303  
Plating NBGS2  
39-27-1104  
39-27-1144  
39-27-1164  
39-27-1204  
39-27-1264  
39-27-1304  
Plating NBT2  
39-28-5105  
39-28-5145  
39-28-5165  
39-28-5205  
Plating NBGS1  
39-27-1343  
39-27-1403  
39-27-1503  
39-27-1603  
39-27-1643  
Plating NBGS2  
39-27-1344  
39-27-1404  
39-27-1504  
39-27-1604  
39-27-1644  
Plating NBT2  
39-28-5345  
39-28-5405  
39-28-5505  
10  
14  
16  
20  
26  
30  
34  
40  
50  
60  
64  
Yes  
Yes  
39-28-5265  
39-28-5305  
PlatingꢀNBGS1:ꢀ39m"ꢀ(1mm)ꢀmin.ꢀNickelꢀunderplate.ꢀContactꢀarea:ꢀ0.1mmꢀmin.ꢀGold.ꢀ  
Solderꢀarea:ꢀ3mmꢀmin.ꢀTin  
PlatingꢀNBGS2:ꢀ39m"ꢀ(1mm)ꢀmin.ꢀNickelꢀunderplate.ꢀContactꢀarea:ꢀ0.76mmꢀmin.ꢀGold.ꢀ  
Solderꢀarea:ꢀ3mmꢀmin.ꢀTin  
PlatingꢀNBT2:ꢀ20m"ꢀ(0.5mm)ꢀmin.ꢀNickelꢀunderplate.ꢀContactꢀandꢀsolderꢀarea:ꢀ39m"ꢀ(1mm)ꢀmin.ꢀTin  
Features and Benefits  
Electrical  
Voltage:ꢀ250V  
Current:ꢀ1.0A  
ContactꢀResistance:ꢀ20ꢀmilliohmsꢀmax.  
DielectricꢀWithstandingꢀVoltage:ꢀ500V  
InsulationꢀResistance:ꢀ1000ꢀMegohmsꢀmin.  
2.54mm (.100") Pitch  
QF-50™  
■
■
■
■
■
■
ꢀ 10ꢀtoꢀ64ꢀcircuits  
ꢀ Tinꢀplatedꢀonꢀsolderꢀtail  
ꢀ CompliesꢀwithꢀindustryꢀstandardꢀDINꢀ41654  
ꢀ Polarized  
ꢀ SelectiveꢀGoldꢀplatingꢀoptionsꢀforꢀcontacts  
ꢀ Ejectꢀleversꢀallowꢀend-to-endꢀstackingꢀwithꢀorꢀwithoutꢀ  
strainꢀreliefꢀwithꢀnoꢀlossꢀofꢀboardꢀspace  
Shrouded Header  
5578  
Right Angle  
With Eject Levers  
Physical  
Housing:ꢀGlass-filledꢀPBTP  
Contact:ꢀBrass  
Reference Information  
Packaging:ꢀTray  
OperatingꢀTemperature:ꢀ-40ꢀtoꢀ+105˚C  
MatesꢀWith:ꢀ5320ꢀ  
DesignedꢀIn:ꢀMillimetersꢀ  
Order No.  
Order No.  
Circuits  
Lead-free  
Circuits  
Lead-free  
Plating NBGS17F  
39-53-6108  
39-53-6148  
39-53-6168  
39-53-6208  
39-53-6268  
39-53-6308  
Plating NBGS2  
39-53-6109  
39-53-6149  
39-53-6169  
39-53-6209  
39-53-6269  
39-53-6309  
Plating NBT2  
39-28-5106  
39-28-5146  
39-28-5166  
39-28-5206  
Plating NBGS17F  
39-53-6348  
39-53-6408  
39-53-6508  
39-53-6608  
Plating NBGS2  
39-53-6349  
39-53-6409  
39-53-6509  
39-53-6609  
39-53-6649  
Plating NBT2  
39-28-5346  
39-28-5406  
39-28-5506  
10  
14  
16  
20  
26  
30  
34  
40  
50  
60  
64  
Yes  
Yes  
39-28-5266  
39-28-5306  
39-53-6648  
PlatingꢀNBGS1:ꢀ39m"ꢀ(1mm)ꢀmin.ꢀNickelꢀunderplate.ꢀContactꢀarea:ꢀ0.1mmꢀmin.ꢀGold.ꢀ  
Solderꢀarea:ꢀ3mmꢀmin.ꢀTin.  
PlatingꢀNBGS2:ꢀ39m"ꢀ(1mm)ꢀmin.ꢀNickelꢀunderplate.ꢀContactꢀarea:ꢀ0.76mmꢀmin.ꢀGold.ꢀ  
Solderꢀarea:ꢀ3mmꢀmin.ꢀTin.  
PlatingꢀNBT2:ꢀ20m"ꢀ(0.5mm)ꢀmin.ꢀNickelꢀunderplate.ꢀContactꢀandꢀsolderꢀarea:ꢀ39m"ꢀ(1mm)ꢀmin.ꢀTin.  
www.molex.com/product/ribbon/qfintro.html  
MX07 G-13  
1

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