O PTIPIN™ HEAT SINKS
FO R BALL GRID ARRAY (BGA) APPLICATIO NS
Aavid’s heat sinks cool BGA, Super BGA, QFP,
PLCC, and PBGA packaged devices.Typical appli-
cations include set-top boxes, cable modems,
sound and video cards, automotive global posi-
tioning systems(GPS), high resolution printers,
and high-speed network routers.
Aavid’s BGA heat sinks come with a number of
mounting options and in many popular sizes to
fit most applications.
35 x 35 mm OptiPin
THERMAL PERFORMANCE
FEATURES:
• The first OptiPin heat sink, the 40 x 40 mm,
cools Intel’s i960® RP/RD embedded micro-
processors
AIR VELOCITY FT/MIN
100 200 300 400 500 600
0
100
20
18
16
14
12
10
8
6
4
2
0
90
80
70
60
50
40
30
20
10
3718
3719
3720
• Micro-thin fins provide 20% more cooling per-
formance than conventional cross-cut heat
sinks, making these the optimum cooling solu-
tion for most applications
• The 35 x 35 mm footprint is available in three
different heights: 7.0 mm, 14.0 mm, and 27.9 mm
(see below for part number information).
0
0
1
2
3
4
5
6
HEAT DISSIPATED (WATTS)
• All OptiPins come with a standard anodized
finish, and are available with double-sided ther-
mal interface tape particular to metal, ceramic,
or plastic packages, or without tape for epoxy
attachment
40 x 40 mm OptiPin
THERMAL PERFORMANCE
AIR FLOW (FT/MIN)
0
200
400
600
100
90
80
70
60
50
40
30
20
10
0
9
8
7
6
5
4
3
2
NOTE: 1070 tape attaches the OptiPin to ceramic and
metal packages and T410 attaches to plastic packages.
3644
1
0
0
4
8
10
POWER (WATTS)
O RDERING INFO RMATIO N
SIZE
L x W
(m m )
HEIGHT
(m m )
FO R EPOXY
ATTACHMENT
1070* TW O -SIDED,
PRE-APPLIED
THERMAL TAPE
T410* TW O -SIDED,
PRE-APPLIED
THERMAL TAPE
35 X 35
35 X 35
35 X 35
40 X 40
7.0
14.0
27.9
11.4
371824B00000
371924B00000
372024B00000
364424B00000
371824B00032
371924B00032
372024B00032
364424B00032
371824B00034
371924B00034
372024B00034
364424B00034
NOTE: 1070 tape is for attachment to ceramic or metal packages; and T410 is for attachment to plastic packages.