5秒后页面跳转
371924B00034 PDF预览

371924B00034

更新时间: 2024-11-25 10:06:15
品牌 Logo 应用领域
爱美达 - AAVID /
页数 文件大小 规格书
4页 101K
描述
Heat Sink,

371924B00034 数据手册

 浏览型号371924B00034的Datasheet PDF文件第2页浏览型号371924B00034的Datasheet PDF文件第3页浏览型号371924B00034的Datasheet PDF文件第4页 
O PTIPIN HEAT SINKS  
FO R BALL GRID ARRAY (BGA) APPLICATIO NS  
Aavids heat sinks cool BGA, Super BGA, QFP,  
PLCC, and PBGA packaged devices.Typical appli-  
cations include set-top boxes, cable modems,  
sound and video cards, automotive global posi-  
tioning systems(GPS), high resolution printers,  
and high-speed network routers.  
Aavids BGA heat sinks come with a number of  
mounting options and in many popular sizes to  
fit most applications.  
35 x 35 mm OptiPin  
THERMAL PERFORMANCE  
FEATURES:  
• The first OptiPin heat sink, the 40 x 40 mm,  
cools Intels i960® RP/RD embedded micro-  
processors  
AIR VELOCITY FT/MIN  
100 200 300 400 500 600  
0
100  
20  
18  
16  
14  
12  
10  
8
6
4
2
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
3718  
3719  
3720  
Micro-thin fins provide 20% more cooling per-  
formance than conventional cross-cut heat  
sinks, making these the optimum cooling solu-  
tion for most applications  
• The 35 x 35 mm footprint is available in three  
different heights: 7.0 mm, 14.0 mm, and 27.9 mm  
(see below for part number information).  
0
0
1
2
3
4
5
6
HEAT DISSIPATED (WATTS)  
• All OptiPins come with a standard anodized  
finish, and are available with double-sided ther-  
mal interface tape particular to metal, ceramic,  
or plastic packages, or without tape for epoxy  
attachment  
40 x 40 mm OptiPin  
THERMAL PERFORMANCE  
AIR FLOW (FT/MIN)  
0
200  
400  
600  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
9
8
7
6
5
4
3
2
NOTE: 1070 tape attaches the OptiPin to ceramic and  
metal packages and T410 attaches to plastic packages.  
3644  
1
0
0
4
8
10  
POWER (WATTS)  
O RDERING INFO RMATIO N  
SIZE  
L x W  
(m m )  
HEIGHT  
(m m )  
FO R EPOXY  
ATTACHMENT  
1070* TW O -SIDED,  
PRE-APPLIED  
THERMAL TAPE  
T410* TW O -SIDED,  
PRE-APPLIED  
THERMAL TAPE  
35 X 35  
35 X 35  
35 X 35  
40 X 40  
7.0  
14.0  
27.9  
11.4  
371824B00000  
371924B00000  
372024B00000  
364424B00000  
371824B00032  
371924B00032  
372024B00032  
364424B00032  
371824B00034  
371924B00034  
372024B00034  
364424B00034  
NOTE: 1070 tape is for attachment to ceramic or metal packages; and T410 is for attachment to plastic packages.  

与371924B00034相关器件

型号 品牌 获取价格 描述 数据表
371924B00034G AAVID

获取价格

Heat Sink, Fin, Pin Fin Array, Omnidirect, Anodized, ROHS COMPLIANT
37194 SCHOTT

获取价格

T3 PACKAGE
371BCR050K ILLINOISCAPACITOR

获取价格

+85°C Temperature Stable Ceramic Disc Capacit
372 LITTELFUSE

获取价格

SUBMINIATURE FUSES
3720-0-14-15-00-00-03-0 MILL-MAX

获取价格

PCB Terminal,
3720040000 LITTELFUSE

获取价格

SUBMINIATURE FUSES
37200400001 LITTELFUSE

获取价格

Electric Fuse, Time Lag Blow, 0.04A, 250VAC, 35A (IR), Through Hole, TR5, HALOGEN FREE AND
3720040010 LITTELFUSE

获取价格

Electric Fuse, 0.04A, 250VAC, 35A (IR), Through Hole, ROHS COMPLIANT
3720040041 LITTELFUSE

获取价格

SUBMINIATURE FUSES
37200400410 LITTELFUSE

获取价格

Electric Fuse, Time Lag Blow, 0.04A, 250VAC, 35A (IR), Through Hole, ROHS COMPLIANT