IHLM-2525CZ-01
Vishay Dale
Molded, Low Profile, High Current Inductors
FEATURES
• Lowest molded height (3.0 mm) in this package
footprint
• Shielded construction
• Frequency range up to 5.0 MHz
• Lowest DCR/µH, in this package size
• Handles high transient current spikes without saturation
• Ultra low buzz noise, due to composite construction
• Encapsulated body offers improved environmental
protection and moisture resistance
Manufactured under one or more of the following:
US Patents; 6,198,375/6,204,744/6,449,829/6,460,244.
Several foreign patents, and other patents pending.
• Higher dielectric withstanding voltage vs. IHLP
• Flame retardant encapsulant (UL 94 V-0)
• Corrosion resistant package
STANDARD ELECTRICAL SPECIFICATIONS
L0
HEAT
INDUCTANCE
DCR DCR
RATING SATURATION
20 % AT 100 kHz, TYP. MAX. CURRENT
0.25 V, 0 A
(µH)
CURRENT
DC TYP.
(A) (4)
• Compliant to RoHS directive 2002/95/EC
25 °C 25 °C DC TYP.
(mΩ) (mΩ)
(A) (3)
32.5
26
24
23
20
17.5
15.5
13
11
9
APPLICATIONS
• PDA/notebook/desktop/server applications
• High current POL converters
• Low profile, high current power supplies
• Battery powered devices
• DC/DC converters in distributed power systems
• DC/DC converter for Field Programmable Gate Array
(FPGA)
• Harsh environments including moisture, chemicals and
salt spray
0.10
0.15
0.20
0.22
0.33
0.47
0.68
0.82
1.0
1.5
1.9
2.4
2.5
3.5
4
1.7
2.5
3.0
2.8
3.9
4.2
5.5
8
60
52
41
40
30
26
25
24
22
18
14
13.5
10
8
5
6.7
9
10
1.5
14
18
28
37
54
64
102
15
DIMENSIONS in inches [millimeters]
2.2
20
8
3.3
30
6
Typical Pad Layout (Min.)
4.7
40
5.5
4.5
4
0.125
[3.18ꢀ
0.255 0.010
[6.47 0.254ꢀ
0.135
[3.43ꢀ
6.8
60
0.146
[3.71ꢀ
8.2
68
7.5
7.0
10
105
3
0.290
[7.37ꢀ
Notes
0.270 0.015
(1)
(2)
(3)
(4)
(5)
[6.86 0.381ꢀ
All test data is referenced to 25 °C ambient
Operating temperature range - 55 °C to + 125 °C
DC current (A) that will cause an approximate ΔT of 40 °C
DC current (A) that will cause L0 to drop approximately 20 %
The part temperature (ambient + temp rise) should not exceed
125 °C under worst case operating conditions. Circuit design,
component placement, PWB trace size and thickness, airflow
and other cooling provisions all affect the part temperature. Part
temperature should be verified in the end application.
0.118 [3.0ꢀ Max.
0.050 0.012
[1.27 0.30ꢀ
DESCRIPTION
IHLM-2525CZ-01
1.0 µH
20 %
ER
e3
MODEL
INDUCTANCE VALUE INDUCTANCE TOLERANCE
PACKAGE CODE JEDEC LEAD (Pb)-FREE STANDARD
GLOBAL PART NUMBER
I
H
L
M
2
5
2
5
C
Z
E
R
1
R
0
M
0
1
PRODUCT FAMILY
SIZE
PACKAGE
CODE
INDUCTANCE
VALUE
TOL
SERIES
Document Number: 34172
Revision: 11-May-09
For technical questions, contact: magnetics@vishay.com
www.vishay.com
1