Effective May 2017
Supersedes March 2010
Technical Data 4321
HALOGEN
3216TD
HF
Pb
FREE
Time-delay Chip™ surface mount fuse
Environmental data
• Operating temperature range: -55 °C to +125 °C
with proper derating
• Vibration: MIL-STD-202, Method 204 Condition D
• Solderability: ANSI/J-STD-002C, Test B
Soldering method
• Wave immersion: 260°C, 10 Sec. max.
• Infrared reflow: 260°C, 30 Sec. max.
• Hand solder: 350°C, 3 Sec. max.
Product features
• Time-delay, surface mount fuse
• RoHS compliant, lead-free and halogen-free
• High inrush withstand capability
• Wire-in-Air performance
• Compatible with leaded and lead-free reflow and
wave solder
Ordering
• Specify packaging and product code
(i.e., TR/3216TD1-R)
Electrical Characteristics
Agency information
% of Amp Rating
100%
Opening Time
4 Hours Minimum
1 Sec. Minimum, 120 Sec. Maximum
0.05 Sec. Minimum, 3 Sec. Maximum
0.002 Sec. Minimum, 0.05 Sec. Maximum
• cURus Recognition File number: E19180
200%
300%
800%
Speciꢀcations
Current
Rating
Amps
6.3
Interrupting
Typical
Resistance
(Ω)**
Typical
Typical
2
Voltage Rating
Product Code
Rating (Amps)*
Melt I t†
Voltage
Vac
32
32
32
32
32
Vdc
AC
35
35
35
35
35
DC
Drop (mV)‡
DC
35
35
35
35
35
3216TD6.3-R
3216TD7-R
3216TD8-R
3216TD10-R
3216TD12-R
32
0.006
10.54
12.03
16.03
42.71
45.56
56
64
65
72
79
7
32
32
32
32
0.006
8
0.0055
0.0045
0.00425
10
12
*
AC Interrupting Rating (Measured at rated voltage with a unity power factor); DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source)
** DC Cold Resistance (Measured at 10% of rated current)
2
†
‡
Typical MeltingtI (Measured with a battery bank at rated DC voltage, 10x-rated current at 1 microsecond, not to exceed IR. Above 7A uses 70 micron thickness copper layer test board of IEC 60127-3
Others uses 35 micron thickness copper layer.
Typical Voltage Drop (Measured at rated current after temperature stabilizes)
Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatu