2N7002W, 2V7002W
Small Signal MOSFET
60 V, 340 mA, Single, N−Channel, SC−70
Features
• ESD Protected
• Low R
DS(on)
http://onsemi.com
• Small Footprint Surface Mount Package
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
Compliant
(Note 1)
• 2V Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
60 V
1.6 W @ 10 V
2.5 W @ 4.5 V
340 mA
Applications
• Low Side Load Switch
• Level Shift Circuits
SIMPLIFIED SCHEMATIC
• DC−DC Converter
1
2
Gate
• Portable Applications i.e. DSC, PDA, Cell Phone, etc.
3
Drain
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
60
Unit
V
Source
V
DSS
(Top View)
V
GS
20
V
Drain Current (Note 1)
Steady State
I
D
mA
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain
T = 25°C
A
310
220
A
T = 85°C
t < 5 s
T = 25°C
A
340
240
A
3
T = 85°C
Power Dissipation (Note 1)
Steady State
P
mW
D
280
330
71 MG
SC−70/SOT−323
CASE 419
t < 5 s
G
Pulsed Drain Current (t = 10 ms)
I
1.4
A
DM
STYLE 8
p
1
2
Operating Junction and Storage
Temperature Range
T , T
−55 to
+150
°C
Gate
Source
J
STG
71 = Device Code
Source Current (Body Diode)
I
250
260
mA
S
M
= Date Code
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
°C
G
= Pb−Free Package
L
(Note: Microdot may be in either location)
Gate−Source ESD Rating
(HBM, Method 3015)
ESD
900
V
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†
Device
Package
Shipping
2N7002WT1G
SC−70
3000/Tape & Reel
(Pb−Free)
THERMAL CHARACTERISTICS
2V7002WT1G
SC−70
(Pb−Free)
3000/Tape & Reel
Characteristic
Symbol
Max
Unit
Junction−to−Ambient − Steady State
R
450
°C/W
q
JA
(Note 1)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Junction−to−Ambient − t ≤ 5 s (Note 1)
R
375
q
JA
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces)
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
September, 2012 − Rev. 5
2N7002W/D