2N7002K, 2V7002K
Small Signal MOSFET
60 V, 380 mA, Single, N−Channel, SOT−23
Features
• ESD Protected
• Low R
DS(on)
http://onsemi.com
• Surface Mount Package
• 2V Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
1.6 W @ 10 V
2.5 W @ 4.5 V
60 V
380 mA
SIMPLIFIED SCHEMATIC
Applications
• Low Side Load Switch
• Level Shift Circuits
Gate
1
• DC−DC Converter
3
Drain
• Portable Applications i.e. DSC, PDA, Cell Phone, etc.
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Source
2
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
(Top View)
V
GS
20
V
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain
Drain Current (Note 1)
Steady State 1 sq in Pad
I
D
mA
T = 25°C
A
380
270
3
A
T = 85°C
3
Drain Current (Note 2)
I
mA
D
1
Steady State Minimum Pad
T = 25°C
A
320
230
A
2
T = 85°C
704 MG
SOT−23
CASE 318
STYLE 21
Power Dissipation
Steady State 1 sq in Pad
Steady State Minimum Pad
P
mW
G
D
420
300
1
2
Gate
Source
Pulsed Drain Current (t = 10 ms)
I
1.5
A
p
DM
704
M
= Specific Device Code*
= Date Code*
= Pb−Free Package
Operating Junction and Storage
Temperature Range
T , T
−55 to
+150
°C
J
STG
G
(Note: Microdot may be in either location)
Source Current (Body Diode)
I
S
300
260
mA
*Specific Device Code, Date Code or overbar
orientation and/or location may vary depend-
ing upon manufacturing location. This is a
representation only and actual devices may
not match this drawing exactly.
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
°C
L
Gate−Source ESD Rating
(HBM, Method 3015)
ESD
2000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq in pad size with 1 oz Cu.
2. Surface−mounted on FR4 board using 0.08 sq in pad size with 1 oz Cu.
ORDERING INFORMATION
†
Device
Package
Shipping
2N7002KT1G
SOT−23
3000 / Tape & Reel
(Pb−Free)
2V7002KT1G
SOT−23
3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
February, 2013 − Rev. 11
2N7002K/D