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2SK3924-01SJ PDF预览

2SK3924-01SJ

更新时间: 2024-02-01 12:25:46
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富士电机 - FUJI /
页数 文件大小 规格书
4页 155K
描述
N-CHANNEL SILICON POWER MOSFET

2SK3924-01SJ 数据手册

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2SK3924-01L,S,SJ  
N-CHANNEL SILICON POWER MOSFET  
200406  
Outline Drawings (mm)  
FUJI POWER MOSFET  
Super FAP-G Series  
Features  
High speed switching  
No secondary breakdown  
Avalanche-proof  
Low on-resistance  
Low driving power  
See to P4  
Applications  
Switching regulators  
DC-DC converters  
UPS (Uninterruptible Power Supply)  
Maximum ratings and characteristic  
Absolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Equivalent circuit schematic  
Item  
Symbol  
Ratings  
250  
Unit  
V
Remarks  
Drain(D)  
Drain-source voltage  
VDS  
VDSX  
ID  
220  
V
VGS=-30V  
Continuous Drain Current  
Pulsed Drain Current  
14  
A
ID(puls]  
VGS  
IAR  
±56  
A
Gate-Source Voltage  
±30  
V
Gate(G)  
Maximum Avalanche current  
Non-Repetitive  
14  
A
Note *1  
Note *2  
Source(S)  
EAS  
301.1  
mJ  
<
Note *1:Tch 150°C,Repetitive and Non-repetitive  
=
Maximum Avalanche Energy  
Repetitive  
Note *2:StartingTch=25°C,IAS=6A,L=14.1mH,  
EAR  
10.5  
mJ  
Note *3  
VCC=48V,RG=50Ω  
Maximum Avalanche Energy  
Maximum Drain-Source dV/dt  
Peak Diode Recovery dV/dt  
Peak Diode Recovery -di/dt  
Max. Power Dissipation  
EAS limited by maximum channel temperature  
and Avalanche current.  
dVDS/dt  
dV/dt  
-di/dt  
PD  
20  
5
kV/µs  
<
VDS 250V  
=
kV/µs Note *4  
See to the ‘Avalanche Energy’ graph  
Note *3:Repetitive rating:Pulse width limited by  
maximum channel temperature.  
See to the ‘Transient Thermal impedance’  
graph.  
100  
105  
1.67  
+150  
Note *5  
A/µs  
W
Tc=25°C  
Ta=25°C  
Operating and Storage  
Temperature range  
Tch  
°C  
Tstg  
-55 to +150 °C  
<
<
<
Note *4:IF -ID, -di/dt=100A/µs,VCC BVDSS,Tch 150°C  
=
<
=
=
<
<
Note *5:IF -ID, dv/dt=5kV/µs,VCC BVDSS,Tch 150°C  
Electrical characteristics (Tc =25°C unless otherwise specified)  
=
=
=
Max. Units  
V
Min.  
Typ.  
Symbol  
BVDSS  
VGS(th)  
Item  
Test Conditions  
µ
Drain-Source Breakdown Voltage  
Gate Threshold Voltage  
ID= 250 A  
VGS=0V  
VDS=VGS  
250  
3.0  
µ
V
ID= 250 A  
5.0  
25  
2.0  
100  
280  
µA  
mA  
nA  
Tch=25°C  
VDS=250V VGS=0V  
Zero Gate Voltage Drain Current  
IDSS  
Tch=125°C  
VDS=200V VGS=0V  
VGS=±30V  
VDS=0V  
ID=7A VGS=10V  
IGSS  
RDS(on)  
gfs  
Gate-Source Leakage Current  
Drain-Source On-State Resistance  
Forward Transconductance  
Input Capacitance  
220  
10  
mΩ  
S
5
ID=7A VDS=25V  
VDS=75V  
Ciss  
Coss  
Crss  
td(on)  
tr  
780  
90  
1170  
135  
pF  
Output Capacitance  
VGS=0V  
6.0  
9.0  
18  
4.5  
Reverse Transfer Capacitance  
Turn-On Time ton  
f=1MH  
ns  
12  
3
VCC=48V ID=7A  
VGS=10V  
23  
6
35  
9
td(off)  
tf  
Turn-Off Time toff  
RGS=10 Ω  
22  
33  
11  
QG  
nC  
Total Gate Charge  
VCC=125V  
ID=14A  
7.0  
QGS  
QGD  
VSD  
Gate-Source Charge  
Gate-Drain Charge  
6.0  
9.0  
1.50  
250  
1.25  
VGS=10V  
1.00  
V
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
IF=14A VGS=0V Tch=25°C  
IF=14A VGS=0V  
-di/dt=100A/µs  
Tch=25°C  
120  
0.5  
trr  
Qrr  
ns  
µC  
Thermal characteristics  
Item  
Symbol  
Rth(ch-c)  
Rth(ch-a)  
Test Conditions  
channel to case  
channel to ambient  
Min.  
Typ.  
Max. Units  
1.191 °C/W  
Thermal resistance  
°C/W  
75  
www.fujielectric.co.jp/fdt/scd  
1

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