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2SK3923-01_05 PDF预览

2SK3923-01_05

更新时间: 2022-09-18 12:31:42
品牌 Logo 应用领域
富士电机 - FUJI /
页数 文件大小 规格书
4页 192K
描述
N-CHANNEL SILICON POWER MOSFET

2SK3923-01_05 数据手册

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2SK3923-01  
Super FAP-G Series  
Features  
FUJI POWER MOSFET  
200509  
N-CHANNEL SILICON POWER MOSFET  
Outline Drawings [mm]  
TO-220AB  
High speed switching  
No secondary breadown  
Avalanche-proof  
Low on-resistance  
Low driving power  
Applications  
Switching regulators  
DC-DC converters  
UPS (Uninterruptible Power Supply)  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol  
VDS  
Ratings  
250  
220  
14  
Unit  
V
Remarks  
Drain-source voltage  
V
A
A
V
A
VGS=-30V  
VDSX  
ID  
Continuous drain current  
Pulsed drain current  
ID(puls]  
VGS  
±56  
±30  
14  
Gate-source voltage  
Repetitive or non-repetitive  
IAR  
Note *1  
Note *2  
Note *3  
Non-repetitive  
Maximum avalanche energy  
Repetitive  
Maximum avalanche energy  
Maximum drain-source dV/dt  
Peak diode recovery dV/dt  
Peak diode recovery -di/dt  
Maximum power dissipation  
mJ  
EAS  
301.1  
10.5  
20  
mJ  
Equivalent circuit schematic  
<
dVDS/dt  
dV/dt  
-di/dt  
PD  
VDS 250V  
=
kV/μs  
kV/μs  
A/μs  
W
5
Note *4  
Drain(D)  
100  
Note *5  
2.02  
°C  
°C  
Ta=25  
105  
W
Tc=25  
Operating and storage  
Tch  
+150  
°C  
temperature range  
<
Tstg  
°C  
-55 to +150  
Gate(G)  
Note *1 Tch 150°C  
=
Source(S)  
Note *2 Starting Tch=25°C, IAS=6A, L=14.1mH, VCC=48V, RG=50Ω  
EAS limited by maximum channel temperrature and avalanche current.  
See to ‘Avalanche Energy’ graph.  
Note *3 Repetitve rating : Pulse width limited by maximum channel temperature.  
See to ‘Transient Thermal impedance’ graph.  
<
<
<
Note *4 IF -ID, -di/dt=100A/μs, Vcc BVDSS, Tch 150°C  
=
=
=
<
<
<
Note *5 IF -ID, dv/dt=5kV/μs, Vcc BVDSS, Tch 150°C  
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Test Conditions  
Symbol  
V(BR)DSS  
VGS(th)  
Item  
μ
ID= 250 A  
VGS=0V  
Drain-source breakdown voltage  
Gate threshold voltage  
V
250  
μ
ID= 250 A  
VDS=VGS  
V
3.0  
5.0  
25  
2.0  
100  
Tch=25°C  
μA  
mA  
nA  
VDS=250V VGS=0V  
VDS=200V VGS=0V  
VGS=±30V  
VDS=0V  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
IGSS  
RDS(on)  
gfs  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
ID=7A VGS=10V  
220  
10  
780  
90  
6
280  
mΩ  
S
5
ID=7A VDS=25V  
VDS=75V  
Ciss  
Coss  
Crss  
td(on)  
tr  
pF  
1170  
135  
9
VGS=0V  
Output capacitance  
f=1MHz  
Reverse transfer capacitance  
Turn-on time ton  
ns  
VCC=48V ID=7A  
12  
3
18  
4.5  
VGS=10V  
23  
6
35  
9
td(off)  
tf  
Turn-off time toff  
RGS=10 Ω  
VCC=125V  
ID=14A  
22  
33  
11  
QG  
nC  
Total Gate Charge  
7.0  
QGS  
QGD  
VSD  
Gate-Source Charge  
Gate-Drain Charge  
6.0  
9.0  
1.50  
250  
1.25  
VGS=10V  
1.00  
IF=14A VGS=0V Tch=25°C  
IF=14A VGS=0V  
-di/dt=100A/μs  
V
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
120  
0.5  
trr  
Qrr  
ns  
μC  
Tch=25°C  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
1.191  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
62.0  
°C/W  
http://www.fujielectric.co.jp/fdt/scd/  
1

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