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2SK3801 PDF预览

2SK3801

更新时间: 2024-11-17 06:24:03
品牌 Logo 应用领域
三垦 - SANKEN 晶体晶体管功率场效应晶体管
页数 文件大小 规格书
1页 42K
描述
MOSFET

2SK3801 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-3P
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.36
雪崩能效等级(Eas):400 mJ配置:SINGLE
最小漏源击穿电压:40 V最大漏极电流 (ID):70 A
最大漏源导通电阻:6 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):140 A
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON
Base Number Matches:1

2SK3801 数据手册

  
MOS FET 2SK3801  
Absolute Maximum Ratings (Ta=25ºC)  
Electrical Characteristics  
External Dimensions TO-3P  
(Ta=25ºC)  
Unit  
Ratings  
typ  
Symbol  
Ratings  
40  
Unit  
V
0.4  
Symbol  
Test Conditions  
15.6  
0.2  
min  
40  
max  
V
DSS  
4.8  
13.6  
9.6  
0.1  
V
GSS  
20  
V
I
D
= 100µA, V = 0 V  
V
(BR) DSS  
GS  
V
2.0  
V
=
15V  
I
70  
140  
A
I
I
V
GS  
10  
100  
4.0  
µA  
µA  
V
S
D
GSS  
1
V
V
= 40V,  
= 10V,  
= 10V,  
= 10V,  
V
GS  
= 0 V  
I
*
A
DS  
D (pulse)  
DSS  
P
D
I
= 1mA  
= 35A  
= 35A  
2.0  
30  
3.0  
50  
100 (Tc=25ºC)  
400  
W
mJ  
ºC  
ºC  
TH  
DS  
D
0.1  
a
b
3.2  
1
EAS  
*
Re  
R
V
I
D
(yfs)  
DS  
GS  
T
V
I
D
5.0  
6.0  
mΩ  
pF  
pF  
pF  
ns  
150  
ch  
DS (ON)  
Tstg  
5100  
1200  
860  
100  
100  
300  
130  
0.9  
–40 to +150  
Ciss  
Coss  
Crss  
V
= 10V  
DS  
2
f =1.0MHz  
= 0 V  
*
*
1: PW 100µs, duty cycle 1%  
2: VDD = 20V, L =1mH, IL = 20A, unclamped,  
RG = 50Ω  
3
V
GS  
0.65+00..12  
1.4  
1.05+00..12  
t
t
t
t
d (on)  
I
D
= 35A  
0.1  
0.1  
ns  
r
5.45  
5.45  
V
DD  
= 20V,  
R = 2 2 Ω  
G
ns  
d (off)  
f
0.2  
15.8  
R
L
= 0.57,  
V = 10V  
GS  
a) Part No.  
b) Lot No.  
ns  
1. Gate  
2. Drain  
3. Source  
V
ns  
V
t
I
SD  
= 50A, V = 0 V  
1.5  
SD  
GS  
(Unit: mm)  
(1) (2) (3)  
I
= 25A, di/dt =50A/µs  
100  
rr  
SD  
R
R
1.25  
°C/W  
°C/W  
th (ch-c)  
th (ch-a)  
35.71  
Characteristics (typ.)  
GS Characteristics (typ.)  
GS Characteristics (typ.)  
D Characteristics (typ.)  
(VDS = 10V)  
ID VDS  
ID  
V
VDS  
V
Re (yfs)  
I
(Ta= 25ºC)  
(VDS = 10V)  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1000  
70  
70  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
Tc= 55°C  
25°C  
10V  
5.5V  
5.0V  
100  
10  
150°C  
VGS = 4.5V  
Ta= 150°C  
25°C  
ID = 70A  
35A  
–55°C  
1
1
0
0
0.5  
1.0  
1.5  
2.0  
0
1.0 2.0 3.0 4.0 5.0 6.0 7.0  
0
5
10  
15  
20  
10  
70  
VDS (V)  
VGS (V)  
VGS (V)  
ID (A)  
Characteristics (typ.)  
Characteristics (typ.)  
j-c — Pw Characteristics (Single pulse) Dynamic I/O Characteristics (typ.)  
RDS (ON) ID  
RDS (ON) TC  
Ta= 25ºC  
VGS = 10V  
ID = 35A  
GS = 10V  
V
(ID = 35A)  
30  
20  
10  
0
15  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0
10.0  
10  
VDS  
8.0  
6.0  
4.0  
2.0  
0
10  
5
1
VGS  
VDD = 8V  
12V  
14V  
0.1  
16V  
24V  
0.01  
0
150  
0.00001 0.0001 0.001 0.01  
0.1  
1
10  
100  
0
50  
100  
0
10 20 30 40 50 60 70  
–60 –50  
0
50  
100  
150  
ID (A)  
Tc (ºC)  
Pw (s)  
Qg (nC)  
CapacitanceVDS Characteristics (typ.)  
SD Characteristics (typ.)  
Safe Operating Area (single pulse)  
C Characteristics  
T
IDR  
V
PD  
(Ta= 25ºC)  
(Ta= 25ºC)  
50000  
70  
500  
120  
VGS = 0V  
f= 1MHz  
60  
50  
40  
30  
20  
10  
0
100  
80  
60  
40  
20  
0
100  
10  
1
10000  
Ciss  
Ta= 150°C  
25°C  
1000  
Coss  
–55°C  
Crss  
0.1  
0.1  
100  
0
20 40 60 80 100 120 140 160  
1
10  
100  
0
10  
20  
30  
40  
50  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4  
VDS (V)  
VSD (V)  
VDS (V)  
Tc (ºC)  
112  

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