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2SK3774-01S PDF预览

2SK3774-01S

更新时间: 2024-10-15 14:58:39
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富士电机 - FUJI /
页数 文件大小 规格书
4页 146K
描述
T-pack

2SK3774-01S 数据手册

 浏览型号2SK3774-01S的Datasheet PDF文件第2页浏览型号2SK3774-01S的Datasheet PDF文件第3页浏览型号2SK3774-01S的Datasheet PDF文件第4页 
2SK3774-01L,S,SJ  
FUJI POWER MOSFET  
200311  
N-CHANNEL SILICON POWER MOSFET  
Super FAP-G Series  
Outline Drawings [mm]  
Features  
High speed switching  
No secondary breadown  
Avalanche-proof  
Low on-resistance  
Low driving power  
Applications  
Switching regulators  
DC-DC converters  
UPS (Uninterruptible Power Supply)  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
See to P4  
Item  
Symbol Ratings  
Unit  
V
Remarks  
Drain-source voltage  
VDS  
VDSX  
ID  
300  
300  
32  
V
VGS=-30V  
A
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Non-Repetitive  
A
ID(puls]  
VGS  
IAS  
±128  
±30  
32  
V
<
A
Tch 150°C  
=
Maximum avalanche current  
Non-Repetitive  
mJ  
mJ  
*1  
EAS  
EAR  
597.4  
27  
Maximum avalanche energy  
Repetitive  
*2  
Equivalent circuit schematic  
Maximum avalanche energy  
Maximum Drain-Source dV/dt  
Peak diode recovery dV/dt  
Max. power dissipation  
<
kV/s  
kV/µs  
W
VDS 300V  
dVDS/dt  
dV/dt  
PD  
20  
5
=
Drain(D)  
*3  
Ta=25°C  
Tc=25°C  
2.02  
270  
Operating and storage  
temperature range  
Tch  
+150  
-55 to +150  
°C  
°C  
Tstg  
Gate(G)  
*1 Starting Tch=25°C,IAS=13A,L=6.13mH,Vcc=48V,RG=50  
Source(S)  
EAS limited by maximum channel temperature and avalanche current.  
See to the ‘Avalanche Energy’ graph.  
*2 Repetitive rating : Pulse width limited maximum channel temperature.  
See to the ‘Transient Thermal impedance’ graph.  
<
<
<
*3 IF -ID, -di/dt=50A/µs, VCC BVDSS, Tch 150°C  
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Item  
Symbol  
V(BR)DSS  
VGS(th)  
Test Conditions  
Drain-source breakdown voltaget  
Gate threshold voltage  
µ
V
ID= 250 A  
VGS=0V  
300  
µ
V
ID= 250 A  
VDS=VGS  
3.0  
5.0  
25  
µA  
VDS=300V VGS=0V  
Tch=25°C  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
250  
100  
VDS=240V VGS=0V  
VGS=±30V  
VDS=0V  
ID=16A VGS=10V  
ID=16A VDS=25V  
VDS=25V  
nA  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
IGSS  
RDS(on)  
gfs  
0.10  
0.13  
S
12  
24  
1970  
335  
20  
Ciss  
Coss  
Crss  
td(on)  
tr  
pF  
2955  
502  
30  
Output capacitance  
VGS=0V  
Reverse transfer capacitance  
Turn-on time ton  
f=1MHz  
VCC=180V ID=16A  
ns  
29  
44  
VGS=10V  
7.5  
11  
Turn-off time toff  
td(off)  
tf  
57  
86  
RGS=10 Ω  
7
10.5  
44.5  
18  
67  
nC  
Total Gate Charge  
QG  
VCC=150V  
ID=32A  
27  
Gate-Source Charge  
Gate-Drain Charge  
QGS  
QGD  
VSD  
13.5  
20.5  
VGS=10V  
0.90  
270  
3.0  
1.50  
V
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
IF=32A VGS=0V Tch=25°C  
IF=32A VGS=0V  
-di/dt=100A/µs  
ns  
µC  
trr  
Qrr  
Tch=25°C  
Thermalcharacteristics  
Item  
Symbol  
Test Conditions  
Min.  
Typ.  
Max. Units  
Rth(ch-c)  
channel to case  
0.463  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
75.0  
°C/W  
1

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