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2SK3769-01MR PDF预览

2SK3769-01MR

更新时间: 2024-11-25 07:32:39
品牌 Logo 应用领域
富士电机 - FUJI 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
4页 102K
描述
N-CHANNEL SILICON POWER MOSFET

2SK3769-01MR 技术参数

生命周期:Obsolete零件包装代码:TO-220AB
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.84
Is Samacsys:N雪崩能效等级(Eas):301.1 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:150 V最大漏极电流 (ID):23 A
最大漏源导通电阻:0.1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):92 A
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

2SK3769-01MR 数据手册

 浏览型号2SK3769-01MR的Datasheet PDF文件第2页浏览型号2SK3769-01MR的Datasheet PDF文件第3页浏览型号2SK3769-01MR的Datasheet PDF文件第4页 
2SK3769-01MR  
N-CHANNEL SILICON POWER MOSFET  
Outline Drawings (mm)  
200406  
TO-220F  
FUJI POWER MOSFET  
Super FAP-G Series  
Features  
High speed switching  
No secondary breakdown  
Avalanche-proof  
Low on-resistance  
Low driving power  
Applications  
Switching regulators  
DC-DC converters  
UPS (Uninterruptible Power Supply)  
Maximum ratings and characteristic  
Absolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Equivalent circuit schematic  
Item  
Symbol  
Ratings  
150  
Unit  
V
Remarks  
Drain(D)  
Drain-source voltage  
VDS  
VDSX  
ID  
120  
V
VGS=-30V  
Continuous Drain Current  
Pulsed Drain Current  
Gate-Source Voltage  
23  
A
ID(puls]  
VGS  
IAR  
±92  
A
±30  
V
Gate(G)  
Maximum Avalanche current  
Non-Repetitive  
23  
A
Note *1  
Note *2  
Source(S)  
EAS  
301.1  
mJ  
<
Note *1:Tch 150°C,Repetitive and Non-repetitive  
=
Maximum Avalanche Energy  
Repetitive  
Note *2:StartingTch=25°C,IAS=10A,L=4.42mH,  
EAR  
3.7  
mJ  
Note *3  
VCC=48V,RG=50Ω  
Maximum Avalanche Energy  
Maximum Drain-Source dV/dt  
Peak Diode Recovery dV/dt  
Max. Power Dissipation  
EAS limited by maximum channel temperature  
and Avalanche current.  
dVDS/dt  
dV/dt  
PD  
20  
5
kV/µs  
<
VDS 150V  
=
kV/µs Note *4  
See to the ‘Avalanche Energy’ graph  
Note *3:Repetitive rating:Pulse width limited by  
maximum channel temperature.  
See to the ‘Transient Thermal impedance’  
graph.  
37  
Tc=25°C  
Ta=25°C  
W
2.16  
+150  
Operating and Storage  
Temperature range  
Isolation Voltage  
Tch  
°C  
°C  
Tstg  
VISO  
-55 to +150  
2
t=60sec. f=60Hz  
kVrms  
<
<
<
Note *4:IF -ID, -di/dt = 50A/µs,VCC BVDSS,Tch 150°C  
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)  
Test Conditions  
Min.  
Typ.  
Max. Units  
Symbol  
BVDSS  
VGS(th)  
Item  
µ
ID= 250 A  
VGS=0V  
V
Drain-Source Breakdown Voltage  
Gate Threshold Voltage  
150  
3.0  
µ
ID= 250 A  
VDS=VGS  
V
5.0  
25  
Tch=25°C  
µA  
µA  
nA  
VDS=150V VGS=0V  
VDS=120V VGS=0V  
VGS=±30V  
VDS=0V  
Zero Gate Voltage Drain Current  
IDSS  
Tch=125°C  
250  
100  
100  
IGSS  
RDS(on)  
gfs  
Gate-Source Leakage Current  
Drain-Source On-State Resistance  
Forward Transconductance  
Input Capacitance  
ID=11.5A VGS=10V  
77  
12  
740  
145  
10  
13  
4
mΩ  
S
6
ID=11.5A VDS=25V  
VDS=75V  
Ciss  
Coss  
Crss  
td(on)  
tr  
1100  
220  
15  
19  
6
pF  
VGS=0V  
Output Capacitance  
f=1MH  
Reverse Transfer Capacitance  
Turn-On Time ton  
ns  
VCC=48V  
ID=11.5A  
VGS=10V  
20  
7
30  
11  
td(off)  
tf  
Turn-Off Time toff  
RGS=10 Ω  
23  
10  
6
35  
15  
9
VCC=75V  
QG  
nC  
Total Gate Charge  
ID=23A  
QGS  
QGD  
VSD  
Gate-Source Charge  
Gate-Drain Charge  
VGS=10V  
1.00  
125  
0.7  
1.50  
IF=23A VGS=0V Tch=25°C  
IF=23A VGS=0V  
-di/dt=100A/µs  
Tch=25°C  
V
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
trr  
Qrr  
ns  
µC  
Thermal characteristics  
Item  
Symbol  
Rth(ch-c)  
Rth(ch-a)  
Test Conditions  
channel to case  
channel to ambient  
Min.  
Typ.  
Max. Units  
3.378 °C/W  
Thermal resistance  
°C/W  
58  
www.fujielectric.co.jp/fdt/scd  
1

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