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2SK3681-01 PDF预览

2SK3681-01

更新时间: 2024-11-16 07:32:35
品牌 Logo 应用领域
富士电机 - FUJI 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
4页 121K
描述
N-CHANNEL SILICON POWER MOSFET

2SK3681-01 技术参数

生命周期:Active零件包装代码:TO-247
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:unknownHTS代码:8541.29.00.95
风险等级:5.71Is Samacsys:N
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (ID):43 A最大漏源导通电阻:0.16 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):172 A认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

2SK3681-01 数据手册

 浏览型号2SK3681-01的Datasheet PDF文件第2页浏览型号2SK3681-01的Datasheet PDF文件第3页浏览型号2SK3681-01的Datasheet PDF文件第4页 
2SK3681-01  
200401  
FUJI POWER MOSFET  
N-CHANNEL SILICON POWER MOSFET  
Super FAP-G Series  
Outline Drawings [mm]  
Features  
High speed switching  
No secondary breadown  
Avalanche-proof  
Low on-resistance  
11.6±0.2  
Low driving power  
Applications  
Switching regulators  
DC-DC converters  
UPS (Uninterruptible Power Supply)  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol Ratings  
Unit  
Remarks  
V
Drain-source voltage  
VDS  
VDSX  
ID  
600  
600  
±43  
±172  
±30  
43  
V
A
A
V
A
VGS=-30V  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Non-Repetitive  
ID(puls]  
VGS  
IAS  
Tch=25°C  
*1  
<
Maximum avalanche current  
Repetitive or  
Equivalent circuit schematic  
A
Tch 150°C  
=
IAR  
21.5  
*1  
Maximum avalanche current  
Non-Repetitive  
mJ  
L=802µH  
VCC=60V *2  
EAS  
808.9  
Drain(D)  
Maximum avalanche energy  
Maximum Drain-Source dV/dt  
Peak diode recovery dV/dt  
Max. power dissipation  
<
kV/s  
VDS 600V  
dVDS/dt  
dV/dt  
PD  
20  
5
=
kV/µs *3  
Ta=25°C  
Tc=25°C  
W
2.50  
Gate(G)  
600  
Source(S)  
°C  
°C  
Operating and storage  
temperature range  
Tch  
+150  
-55 to +150  
Tstg  
*1 See to Avalanche Current Graph  
*2 See to Avalanche Energy Graph  
<
<
<
*3 IF -ID, -di/dt=50A/µs, VCC BVDSS, Tch 150°C  
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Item  
Symbol  
V(BR)DSS  
VGS(th)  
Test Conditions  
µ
Drain-source breakdown voltaget  
Gate threshold voltage  
600  
V
ID= 250 A  
VGS=0V  
VDS=VGS  
µ
V
3.0  
5.0  
25  
ID= 250 A  
µA  
Tch=25°C  
VDS=600V VGS=0V  
Zero gate voltage drain current  
IDSS  
250  
100  
Tch=125°C  
VDS=480V VGS=0V  
VGS=±30V  
VDS=0V  
ID=26A VGS=10V  
nA  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
IGSS  
RDS(on)  
gfs  
10  
0.12  
0.16  
15  
30  
5360  
680  
40  
S
ID=21.5A VDS=25V  
Ciss  
Coss  
Crss  
td(on)  
tr  
8040  
1020  
60  
pF  
VDS=25V  
Output capacitance  
VGS=0V  
Reverse transfer capacitance  
Turn-on time ton  
f=1MHz  
VCC=300V ID=21.5A  
ns  
80  
120  
131  
285  
66  
87  
VGS=10V  
190  
44  
Turn-off time toff  
td(off)  
tf  
RGS=10  
112  
34  
168  
51  
nC  
Total Gate Charge  
QG  
VCC=300V  
ID=43A  
Gate-Source Charge  
Gate-Drain Charge  
QGS  
QGD  
IAV  
40  
60  
VGS=10V  
43  
µ
A
Avalanche capability  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
L=802 H Tch=25°C  
1.00  
0.98  
22.0  
1.50  
V
VSD  
IF=43A VGS=0V Tch=25°C  
IF=43A VGS=0V  
-di/dt=100A/µs  
Tch=25°C  
µs  
µC  
trr  
Qrr  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
0.208  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
50.0  
°C/W  
1

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