2SK3605-01
200304
N-CHANNEL SILICON POWER MOSFET
Outline Drawings (mm)
FUJI POWER MOSFET
Super FAP-G Series
Features
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DCconverters
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C unless otherwise specified)
Foot Print Pattern
Item
Symbol
VDS
Ratings
150
Unit
Equivalent circuit schematic
Drain-source voltage
V
VDSX *5
ID Tc=25
Ta=25
ID(puls]
120
±23
V
D : Drain
°C
Continuous drain current
A
°C
3.1 **
±
A
Pulsed drain current
Gate-source voltage
±92
±30
23
A
G : Gate
VGS
V
Non-repetitive Avalanche current IAS *2
A
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power dissipation
EAS *1
dVDS/dt *4
dV/dt *3
PD Tc=25
Ta=25
Tch
130.9
20
mJ
S1 : Source
kV/µs
S2 : Source
5
kV/µs
W
°C
°C
105
2.4 **
Operating and storage
temperature range
** Surface mounted on 1000mm2, t=1.6mm FR-4 PCB(Drain pad area : 500mm2)
+150
°C
°C
Tstg
-55 to +150
<
*1 L=363µH, Vcc=48V,Tch=25°C, See to Avalanche Energy Graph *2 Tch 150°C
=
<
<
<
<
*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C
*4 VDS 150V *5 VGS=-30V
=
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)
Min.
Typ.
Max. Units
Symbol
V(BR)DSS
VGS(th)
Test Conditions
Item
µ
ID= 250 A
VGS=0V
VDS=VGS
V
150
Drain-source breakdown voltaget
Gate threshold voltage
µ
ID= 250 A
V
3.0
5.0
25
µA
Tch=25°C
VDS=150V VGS=0V
VDS=120V VGS=0V
VGS=±30V
VDS=0V
Zero gate voltage drain current
IDSS
Tch=125°C
250
100
105
IGSS
RDS(on)
gfs
nA
10
79
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
ID=8A VGS=10V
mΩ
S
6
12
ID=8A VDS=25V
VDS=75V
Ciss
760
130
6
1140
195
9
pF
Coss
Crss
td(on)
tr
VGS=0V
Output capacitance
f=1MHz
VCC=48V ID=8A
Reverse transfer capacitance
Turn-on time ton
ns
12
18
2.8
22
6.2
4.2
33
9.3
VGS=10V
td(off)
tf
Turn-off time toff
RGS=10 Ω
21
9
31.5
13.5
9
QG
nC
VCC=75V
ID=16A
Total Gate Charge
QGS
QGD
IAV
Gate-Source Charge
Gate-Drain Charge
6
VGS=10V
23
µ
A
L=363 H Tch=25°C
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
1.10
1.65
VSD
trr
Qrr
V
IF=16A VGS=0V Tch=25°C
IF=16A VGS=0V
-di/dt=100A/µs
Tch=25°C
0.13
0.59
µs
µC
Thermalcharacteristics
Item
Min.
Typ.
Max. Units
1.191 °C/W
Symbol
Rth(ch-c)
Test Conditions
channel to case
Thermal resistance
Rth(ch-a)
channel to ambient
channel to ambient
°C/W
°C/W
87.0
52.0
Rth(ch-a) **
** Surface mounted on 1000mm2, t=1.6mm FR-4 PCB(Drain pad area : 500mm2)
1