2SK3596-01L,S,SJ
200304
FUJI POWER MOSFET
N-CHANNEL SILICON POWER MOSFET
Super FAP-G Series
Outline Drawings (mm)
Features
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
P4
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DCconverters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Symbol
VDS
Ratings
200
Unit
V
Drain-source voltage
V
VDSX *5
ID
170
±45
±180
±30
45
Equivalent circuit schematic
A
Continuous drain current
Pulsed drain current
Gate-source voltage
A
ID(puls]
VGS
V
Drain(D)
A
Non-repetitive Avalanche current IAS *2
mJ
kV/µs
kV/µs
W
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power dissipation
EAS *1
dVDS/dt *4
dV/dt *3
PD Ta=25
Tc=25
Tch
258.9
20
5
Gate(G)
°C
°C
1.67
Source(S)
270
+150
-55 to +150
Operating and storage
temperature range
°C
°C
Tstg
<
*2 Tch 150°C
=
*1 L=205µH, Vcc=48V,Tch=25°C, See to Avalanche Energy Graph
<
<
<
<
*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C
*5 VGS=-30V
*4 VDS
200V
=
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)
Min.
Typ.
Max. Units
Symbol
V(BR)DSS
VGS(th)
Test Conditions
Item
µ
ID= 250 A
VGS=0V
VDS=VGS
V
Drain-source breakdown voltaget
Gate threshold voltage
200
µ
ID= 250 A
V
3.0
5.0
25
µA
Tch=25°C
VDS=200V VGS=0V
VDS=160V VGS=0V
VGS=±30V
VDS=0V
Zero gate voltage drain current
IDSS
Tch=125°C
250
100
66
IGSS
RDS(on)
gfs
nA
10
50
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
ID=15A VGS=10V
mΩ
S
ID=15A VDS=25V
VDS=75V
12.5
25
Ciss
Coss
Crss
td(on)
tr
pF
1960
260
18
2940
390
27
VGS=0V
Output capacitance
f=1MHz
VCC=48V ID=15A
Reverse transfer capacitance
Turn-on time ton
ns
20
30
VGS=10V
17
26
td(off)
tf
53
80
Turn-off time toff
RGS=10 Ω
19
29
QG
51
76.5
nC
VCC=100V
ID=30A
Total Gate Charge
QGS
QGD
IAV
15
22.5
24
Gate-Source Charge
Gate-Drain Charge
16
VGS=10V
µ
45
A
L=205 H Tch=25°C
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
1.10
1.65
VSD
V
IF=30A VGS=0V Tch=25°C
IF=30A VGS=0V
-di/dt=100A/µs
Tch=25°C
0.19
1.4
trr
Qrr
µs
µC
Thermalcharacteristics
Item
Symbol
Test Conditions
Min.
Typ.
Max. Units
Rth(ch-c)
channel to case
0.463
°C/W
Thermal resistance
Rth(ch-a)
channel to ambient
75.0
°C/W
www.fujielectric.co.jp/denshi/scd
1