2SK3592-01L,S,SJ
200304
FUJI POWER MOSFET
Super FAP-G Series
Features
N-CHANNEL SILICON POWER MOSFET
Outline Drawings (mm)
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
See to P4
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DCconverters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Symbol
VDS
Ratings
150
Unit
V
Drain-source voltage
V
VDSX *5
ID
120
±57
±228
±30
57
Equivalent circuit schematic
A
Continuous drain current
Pulsed drain current
Gate-source voltage
A
ID(puls]
VGS
V
Drain(D)
A
Non-repetitive Avalanche current IAS *2
mJ
kV/µs
kV/µs
W
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power dissipation
EAS *1
dVDS/dt *4
dV/dt *3
PD Ta=25
Tc=25
Tch
272.5
20
5
Gate(G)
°C
°C
1.67
Source(S)
270
Operating and storage
temperature range
+150
-55 to +150
<
°C
°C
Tstg
*1 L=123µH, Vcc=48V, See to Avalanche Energy Graph
*2 Tch 150°C
=
<
<
<
<
*5 VGS=-30V
*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C
*4 VDS
150V
=
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)
Min.
Typ.
Max. Units
Symbol
V(BR)DSS
VGS(th)
Test Conditions
Item
µ
ID= 250 A
VGS=0V
Drain-source breakdown voltaget
Gate threshold voltage
V
150
µ
ID= 250 A
VDS=VGS
V
3.0
5.0
25
Tch=25°C
µA
VDS=150V VGS=0V
Zero gate voltage drain current
IDSS
Tch=125°C
250
100
41
VDS=120V VGS=0V
VGS=±30V VDS=0V
IGSS
RDS(on)
gfs
nA
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
10
31
ID=20A VGS=10V
mΩ
S
ID=20A VDS=25V
VDS=75V
13
26
Ciss
Coss
Crss
td(on)
tr
pF
1940
310
24
2910
465
36
VGS=0V
Output capacitance
f=1MHz
Reverse transfer capacitance
Turn-on time ton
ns
VCC=48V ID=20A
20
30
26
39
VGS=10V
td(off)
tf
50
75
Turn-off time toff
RGS=10 Ω
20
30
52
78
QG
VCC=75V
ID=40A
nC
Total Gate Charge
15
22.5
27
QGS
QGD
IAV
Gate-Source Charge
Gate-Drain Charge
18
VGS=10V
µ
57
L=123 H Tch=25°C
A
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
1.10
1.65
VSD
IF=40A VGS=0V Tch=25°C
IF=40A VGS=0V
-di/dt=100A/µs
V
0.14
0.77
trr
Qrr
µs
µC
Tch=25°C
Thermalcharacteristics
Item
Symbol
Test Conditions
Min.
Typ.
Max. Units
Rth(ch-c)
channel to case
0.463
°C/W
Thermal resistance
Rth(ch-a)
channel to ambient
75.0
°C/W
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