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2SK3589-01_03 PDF预览

2SK3589-01_03

更新时间: 2024-02-28 11:46:59
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富士电机 - FUJI /
页数 文件大小 规格书
4页 95K
描述
N-CHANNEL SILICON POWER MOSFET

2SK3589-01_03 数据手册

 浏览型号2SK3589-01_03的Datasheet PDF文件第2页浏览型号2SK3589-01_03的Datasheet PDF文件第3页浏览型号2SK3589-01_03的Datasheet PDF文件第4页 
FUJI POWER MOSFET200303  
2SK3589-01  
Super FAP-G Series  
N-CHANNEL SILICON POWER MOSFET  
Outline Drawings [mm]  
Features  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
Applications  
for Switching  
Foot Print Pattern  
Absolute Maximum Ratings at Tc=25°C  
( unless otherwise specified)  
Item  
Symbol  
VDS  
Ratings  
100  
Unit  
V
Remarks  
Equivalent circuit schematic  
Drain-source voltage  
(4) Drain(D)  
VGS=30V  
V
VDSX  
ID  
70  
A
Continuous drain current  
±73  
Ta=25°C  
A
±6.9 *4  
(1) Gate(G)  
A
Pulsed drain current  
ID(puls]  
VGS  
IAR  
±292  
±30  
73  
V
Gate-source voltage  
A
Repetitive or non-repetitive  
Maximum Avalanche Energy  
Maximum Drain-Source dV/dt  
Peak Diode Recovery dV/dt  
Max. power dissipation  
*2  
(3) Source(S)  
mJ  
EAS *1  
dVDS/dt  
dV/dt *3  
PD  
319.2  
20  
(2) Source(S)  
[power line]  
<
[signal line]  
VDS 100V  
=
kV/µs  
kV/µs  
W
5
Ta=25°C  
2.4 *4  
270  
+150  
-55 to +150  
W
Operating and storage  
temperature range  
Tch  
°C  
Tstg  
°C  
<
<
<
<
*2 Tch 150°C  
*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C  
=
*1 L=71.9µH, Vcc=48V, See to Avalanche Energy Graph  
=
=
=
*4 Surface mounted on 1000mm2, t=1.6mm FR-4 PCB(Drain pad area:500mm2)  
Electrical characteristics atTc =25°C ( unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Symbol  
V(BR)DSS  
VGS(th)  
Test Conditions  
Item  
µ
ID=250 A  
VGS=0V  
VDS=VGS  
V
Drain-source breakdown voltaget  
Gate threshold voltage  
100  
3.0  
µ
ID= 250 A  
V
5.0  
µA  
25  
Tch=25°C  
VDS=100V VGS=0V  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
VDS=80V VGS=0V  
250  
IGSS  
RDS(on)  
gfs  
nA  
VDS=0V  
VGS=±30V  
ID=25A VGS=10V  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
10  
19  
100  
m  
S
25  
ID=25A VDS=25V  
VDS=75V  
15  
30  
Ciss  
Coss  
Crss  
td(on)  
tr  
pF  
1830  
460  
38  
2745  
690  
57  
VGS=0V  
Output capacitance  
f=1MHz  
VCC=48V ID=25A  
Reverse transfer capacitance  
Turn-on time ton  
ns  
20  
30  
VGS=10V  
35  
53  
td(off)  
tf  
50  
75  
Turn-off time toff  
RGS=10 Ω  
23  
35  
QG  
nC  
VCC=50V  
ID=50A  
52  
78  
Total Gate Charge  
QGS  
QGD  
IAV  
16  
24  
Gate-Source Charge  
Gate-Drain Charge  
18  
27  
VGS=10V  
µ
73  
A
L=71.5 H Tch=25°C  
Avalanche capability  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
VSD  
1.10  
1.65  
V
IF=50A VGS=0V Tch=25°C  
IF=50A VGS=0V  
-di/dt=100A/µs  
Tch=25°C  
trr  
Qrr  
0.1  
0.4  
µs  
µC  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
0.463 °C/W  
Thermal resistance  
Rth(ch-a)  
Rth(ch-a)  
channel to ambient  
channel to ambient  
87.0  
52.0  
°C/W  
°C/W  
*4  
1

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