FUJI POWER MOSFET
200304
2SK3525-01MR
Super FAP-G Series
Features
N-CHANNEL SILICON POWER MOSFET
Outline Drawings [mm]
TO-220F
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DCconverters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Symbol
VDS
Ratings
600
Unit
V
Drain-source voltage
Continuous drain current
Pulsed drain current
Gate-source voltage
Repetitive or non-repetitive
A
ID
±8
±32
±30
8
Equivalent circuit schematic
A
ID(puls]
VGS
V
A
IAR
*2
*1
Drain(D)
mJ
kV/µs
kV/µs
W
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power dissipation
EAS
145.6
20
dVDS/dt *4
dV/dt
*3
5
°C
°C
PD Ta=25
Tc=25
Tch
2.16
Gate(G)
48
+150
-55 to +150
2
Source(S)
Operating and storage
temperature range
Isolation Voltage
°C
Tstg
°C
VISO
*5
kVrms
<
*1 L=4.2mH, Vcc=60V, See to Avalanche Energy Graph *2 Tch 150°C
=
<
<
<
<
*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C *4 VDS 600V
*5 t=60sec, f=60Hz
=
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)
Min.
Typ.
Max. Units
Symbol
V(BR)DSS
VGS(th)
Test Conditions
Item
µ
ID= 250 A
VGS=0V
Drain-source breakdown voltaget
Gate threshold voltage
600
V
µ
ID= 250 A
VDS=VGS
3.0
5.0
25
V
Tch=25°C
µA
VDS=600V VGS=0V
Zero gate voltage drain current
IDSS
Tch=125°C
250
100
VDS=480V VGS=0V
VGS=±30V VDS=0V
IGSS
RDS(on)
gfs
10
nA
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
ID=3A VGS=10V
0.93
1.20
Ω
3
6
750
100
S
ID=3A VDS=25V
VDS=25V
Ciss
1130
150
pF
Coss
Crss
td(on)
tr
VGS=0V
Output capacitance
f=1MHz
4.0
6.0
Reverse transfer capacitance
Turn-on time ton
ns
VCC=300V ID=3A
14
9
21
14
VGS=10V
24
7
36
td(off)
tf
Turn-off time toff
RGS=10 Ω
10.5
30
20
QG
VCC=300V
ID=6A
nC
Total Gate Charge
8.5
13
QGS
QGD
IAV
Gate-Source Charge
Gate-Drain Charge
5.5
8.5
VGS=10V
8
L=4.2mH Tch=25°C
A
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
1.00
0.7
1.50
VSD
trr
Qrr
IF=6A VGS=0V Tch=25°C
IF=6A VGS=0V
-di/dt=100A/µs
V
µs
µC
3.5
Tch=25°C
Thermalcharacteristics
Item
Min.
Typ.
Max. Units
Symbol
Test Conditions
Rth(ch-c)
channel to case
2.60
°C/W
Thermal resistance
Rth(ch-a)
channel to ambient
58.0
°C/W
1