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2SK3363-01 PDF预览

2SK3363-01

更新时间: 2024-11-17 22:19:31
品牌 Logo 应用领域
富士电机 - FUJI /
页数 文件大小 规格书
4页 122K
描述
N-CHANNEL SILICON POWER MOS-FET

2SK3363-01 技术参数

生命周期:Obsolete零件包装代码:TO-220AB
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.84配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):50 A
最大漏源导通电阻:0.0068 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):200 A
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

2SK3363-01 数据手册

 浏览型号2SK3363-01的Datasheet PDF文件第2页浏览型号2SK3363-01的Datasheet PDF文件第3页浏览型号2SK3363-01的Datasheet PDF文件第4页 
FUJI POWER MOS-FET  
2SK3363-01  
N-CHANNEL SILICON POWER MOS-FET  
TO-220AB  
Features  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
Applications  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DC converters  
3. Source  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Equivalent circuit schematic  
Item  
Drain-source voltage  
Symbol  
VDS  
ID  
Rating  
30  
Unit  
V
Drain(D)  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
±50  
A
ID(puls]  
VGS  
EAV*1  
PD  
±200  
±16  
A
V
Maximum Avalanche Energy  
Max. power dissipation  
Operating and storage  
temperature range  
1735  
80  
mJ  
W
°C  
°C  
Gate(G)  
Source(S)  
Tch  
+150  
Tstg  
-55 to +150  
*1 L=0.925mH, Vcc=12V  
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Item  
Test Conditions  
Symbol  
V(BR)DSS  
VGS(th)  
Drain-source breakdown voltaget  
Gate threshold voltage  
ID=1mA  
ID=1mA  
VGS=0V  
V
30  
VDS=VGS  
V
1.0  
1.5  
10  
0.2  
10  
8.0  
5.3  
70  
2.0  
500  
1.0  
100  
Tch=25°C  
µA  
mA  
nA  
m  
VDS=30V  
VGS=0V  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
VGS=±16V  
Gate-source leakage current  
VDS=0V  
IGSS  
ID=50A VGS=4V  
ID=50A VGS=10V  
ID=50A VDS=25V  
Drain-source on-state resistance  
10.5  
6.8  
RDS(on)  
35  
S
Forward transcondutance  
Input capacitance  
gfs  
3900  
2000  
850  
17  
5850  
VDS=25V  
Ciss  
Coss  
Crss  
td(on)  
tr  
3000  
1280  
30  
pF  
Output capacitance  
VGS=0V  
Reverse transfer capacitance  
Turn-on time ton  
f=1MHz  
VCC=15V ID=100A  
70  
110  
VGS=10V  
ns  
250  
180  
380  
270  
Turn-off time toff  
RGS=10 Ω  
td(off)  
tf  
50  
A
Avalanche capability  
L=100µH Tch=25°C  
IAV  
1.0  
65  
0.12  
1.5  
V
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
IF=50A VGS=0V Tch=25°C  
IF=50A VGS=0V  
-di/dt=100A/µs  
Tch=25°C  
VSD  
ns  
µC  
trr  
Qrr  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
1.56  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
75.0  
°C/W  
1

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