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2SK3037 PDF预览

2SK3037

更新时间: 2024-11-25 22:52:55
品牌 Logo 应用领域
松下 - PANASONIC 晶体小信号场效应晶体管开关
页数 文件大小 规格书
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描述
Silicon N-Channel Power F-MOS FET

2SK3037 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.9Is Samacsys:N
配置:SINGLE WITH BUILT-IN DIODE AND RESISTOR最小漏源击穿电压:150 V
最大漏极电流 (Abs) (ID):10 A最大漏极电流 (ID):10 A
最大漏源导通电阻:0.0003 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):20 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

2SK3037 数据手册

  
Power F-MOS FETs  
2SK3037 (Tentative)  
Silicon N-Channel Power F-MOS FET  
Features  
Avalanche energy capacity guaranteed  
High-speed switching  
Low ON-resistance  
unit: mm  
No secondary breakdown  
Low-voltage drive  
High electrostatic breakdown voltage  
6.5±0.1  
5.3±0.1  
4.35±0.1  
2.3±0.1  
0.5±0.1  
Applications  
Contactless relay  
Diving circuit for a solenoid  
Driving circuit for a motor  
Control equipment  
1.0±0.1  
0.1±0.05  
0.93±0.1  
0.5±0.1  
Switching power supply  
0.75±0.1  
Absolute Maximum Ratings (TC = 25°C)  
2.3±0.1  
4.6±0.1  
Parameter  
Symbol  
Ratings  
Unit  
V
Drain to Source breakdown voltage VDSS  
150  
Gate to Source voltage  
DC  
Pulse  
Avalanche energy capacity  
VGSS  
ID  
±20  
V
1: Gate  
2: Drain  
3: Source  
±10  
A
1
2
3
Drain current  
IDP  
±20  
A
U Type Package  
EAS*  
5
mJ  
Internal Connection  
Allowable power  
dissipation  
TC = 25°C  
Ta = 25°C  
20  
PD  
W
D
1
G
Channel temperature  
Storage temperature  
Tch  
150  
°C  
°C  
Tstg  
55 to +150  
S
*
L = 0.1mH, IL = 10A, 1 pulse  
Electrical Characteristics (TC = 25°C)  
Parameter  
Symbol  
Conditions  
VDS = 120V, VGS = 0  
VGS = ±20V, VDS = 0  
min  
typ  
max  
10  
Unit  
µA  
µA  
V
Drain to Source cut-off current  
Gate to Source leakage current  
IDSS  
IGSS  
±10  
Drain to Source breakdown voltage VDSS  
I
D = 1mA, VGS = 0  
VDS = 10V, ID = 1mA  
RDS(on)1 VGS = 10V, ID = 5A  
150  
1
Gate threshold voltage  
Vth  
2.5  
0.25  
0.3  
V
0.17  
0.2  
7
mΩ  
mΩ  
S
Drain to Source ON-resistance  
RDS(on)2  
| Yfs |  
VGS = 4V, ID = 5A  
Forward transfer admittance  
Diode forward voltage  
VDS = 10V, ID = 5A  
IDR = 10A, VGS = 0  
4
VDSF  
1.4  
V
Input capacitance (Common Source) Ciss  
Output capacitance (Common Source) Coss  
Reverse transfer capacitance (Common Source) Crss  
340  
135  
50  
pF  
VDS = 10V, VGS = 0, f = 1MHz  
pF  
pF  
Turn-on time (delay time)  
Rise time  
td(on)  
tr  
20  
ns  
VDD = 100V, ID = 5A  
100  
420  
1600  
ns  
Fall time  
tf  
VGS = 10V, RL = 20Ω  
ns  
Turn-off time (delay time)  
Thermal resistance between channel and case  
Thermal resistance between channel and atmosphere  
td(off)  
Rth(ch-c)  
Rth(ch-a)  
ns  
6.25  
125  
°C/W  
°C/W  
1

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