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2SK2901-01L PDF预览

2SK2901-01L

更新时间: 2024-11-01 22:52:55
品牌 Logo 应用领域
富士电机 - FUJI 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
4页 117K
描述
N-CHANNEL SILICON POWER MOS-FET

2SK2901-01L 技术参数

生命周期:Obsolete包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.83
Is Samacsys:N雪崩能效等级(Eas):461.9 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (ID):45 A最大漏源导通电阻:0.015 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):180 A
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

2SK2901-01L 数据手册

 浏览型号2SK2901-01L的Datasheet PDF文件第2页浏览型号2SK2901-01L的Datasheet PDF文件第3页浏览型号2SK2901-01L的Datasheet PDF文件第4页 
FUJI POWER MOS-FET  
2SK2901-01L,S  
N-CHANNEL SILICON POWER MOS-FET  
Features  
T-Pack(L)  
T-Pack(S)  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
10+0.5  
4.5 ±0.2  
1.32  
+0.2  
1.2 ±0.2  
—0.1  
0.4+0.2  
0.8  
Applications  
2.7  
5.08  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DC converters  
1. Gate  
2, 4. Drain  
3. Source  
3. Source  
Equivalent circuit schematic  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol  
VDS  
ID  
Rating  
60  
Unit  
V
Drain(D)  
Drain-source voltage  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Maximum Avalanche Energy  
Max. power dissipation  
Operating and storage  
temperature range  
±45  
A
ID(puls]  
VGS  
EAV*1  
PD  
±180  
±30  
A
V
Gate(G)  
461.9  
mJ  
Source(S)  
60  
W
°C  
°C  
Tch  
+150  
Tstg  
-55 to +150  
*1 L=0.304mH, Vcc=24V  
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Item  
Test Conditions  
Symbol  
BVDSS  
VGS(th)  
V
Drain-source breakdown voltaget  
Gate threshold voltage  
ID=1mA  
VGS=0V  
60  
2.5  
V
ID=10mA  
VDS=60V  
VGS=0V  
VDS=VGS  
3.0  
10  
0.2  
3.5  
500  
1.0  
100  
14.5  
µA  
mA  
nA  
Tch=25°C  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
VGS=±30V  
10  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
VDS=0V  
IGSS  
RDS(on)  
gfs  
ID=22.5A VGS=10V  
ID=22.5A VDS=25V  
VDS=25V  
12.0  
25.0  
m  
S
10.0  
2300  
3450  
pF  
Ciss  
910  
260  
18  
1370  
390  
30  
Output capacitance  
VGS=0V  
Coss  
Crss  
td(on)  
tr  
Reverse transfer capacitance  
Turn-on time ton  
f=1MHz  
ns  
VCC=30V ID=45A  
VGS=10V  
55  
80  
70  
120  
80  
Turn-off time toff  
td(off)  
tf  
RGS=10 Ω  
48  
45  
µ
A
Avalanche capability  
IAV  
L=100 H Tch=25°C  
1.0  
60  
0.11  
1.5  
V
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
VSD  
trr  
Qrr  
IF=45A VGS=0V Tch=25°C  
IF=45A VGS=0V  
-di/dt=100A/µs  
Tch=25°C  
ns  
µC  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
2.08  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
125.0  
°C/W  
1

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