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2SJ314-01L PDF预览

2SJ314-01L

更新时间: 2024-11-15 03:56:39
品牌 Logo 应用领域
富士电机 - FUJI /
页数 文件大小 规格书
3页 147K
描述
P-CHANNEL SILICON POWER MOSFET

2SJ314-01L 技术参数

生命周期:Obsolete零件包装代码:TO-251AA
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.84其他特性:AVALANCHE RATED
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):5 A
最大漏极电流 (ID):5 A最大漏源导通电阻:0.48 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-251AA
JESD-30 代码:R-PSIP-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):20 W
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

2SJ314-01L 数据手册

 浏览型号2SJ314-01L的Datasheet PDF文件第2页浏览型号2SJ314-01L的Datasheet PDF文件第3页 
FUJI POWER MOSFET  
2SJ314-01L,S  
P-CHANNEL SILICON POWER MOSFET  
FAP-III SERIES  
Outline Drawings  
Features  
K-Pack(L)  
K-Pack(S)  
High speed switching  
Low on-resistance  
No secondary breakdown  
Low driving power  
High forward Transconductance  
Avalanche-proof  
Applications  
Switching regulators  
DC-DC converters  
General purpose power amplifier  
L-type  
EIAJ  
Maximum ratings and characteristics  
Absolute maximum ratings (Tc=25°C unless otherwise specified)  
Equivalent circuit schematic  
Item  
Symbol  
VDS  
VDGR  
ID  
Rating  
-60  
Unit  
V
Drain-source voltage  
Drain-gate voltage (RGS=20k  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Max. power dissipation  
Operating and storage  
temperature range  
Drain(D)  
Ω
)
-60  
A
-5  
A
Gate(G)  
ID(puls]  
VGS  
PD  
-20  
A
±20  
V
20  
W
°C  
°C  
Tch  
+150  
-55 to +150  
Source(S)  
Tstg  
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Test Conditions  
Symbol  
V(BR)DSS  
VGS(th)  
IDSS  
Item  
ID=1mA  
ID=1mA  
VDS= -60V  
VGS=0V  
VGS=0V  
V
-60  
Drain-source breakdown voltage  
VDS=VGS  
V
-1.0  
-1.5  
-10  
-0.2  
10  
-2.5  
-500  
-1.0  
100  
Gate threshold voltage  
Zero gate voltage drain current  
Tch=25°C  
μA  
mA  
nA  
Tch=125°C  
±20V  
VGS=  
VDS=0V  
IGSS  
Gate-source leakage current  
ID= -2.5A  
VGS= -4V  
280  
200  
4.5  
480  
300  
mΩ  
mΩ  
S
RDS(on)  
Drain-source on-state resistance  
VGS= -10V  
2.0  
ID=2.5A VDS= -25V  
VDS= -25V  
gfs  
Forward transconductance  
Input capacitance  
500  
200  
120  
15  
750  
300  
180  
23  
Ciss  
Coss  
Crss  
td(on)  
tr  
pF  
VGS=0V  
Output capacitance  
f=1MHz  
VCC= -30V RG=25 Ω  
ID= -3A  
Reverse transfer capacitance  
Turn-on time ton  
20  
30  
ns  
(ton=td(on)+tr)  
VGS= -10V  
100  
80  
150  
120  
td(off)  
tf  
Turn-off time toff  
(toff=td(off)+tf)  
μ
L=100 H  
Tch=25°C  
A
-5  
IAV  
Avalanche capability  
Continuous reverse drain current  
Pulsed reverse drain current  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
Tc=25°C  
Tc=25°C  
A
IDR  
IDRM  
VSD  
trr  
-5  
A
-20  
V
IF=2xIDR VGS=0V Tch=25°C  
IF=IDR VGS=0V  
-4.0  
80  
ns  
μC  
-di/dt=100A/μs Tch=25°C  
Qrr  
0.18  
Thermal characteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Rth(ch-c)  
6.25  
°C/W  
Thermal resistance  
Rth(ch-a)  
125.0  
°C/W  
1

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