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2NP09 PDF预览

2NP09

更新时间: 2024-10-15 18:10:03
品牌 Logo 应用领域
科信 - KEXIN /
页数 文件大小 规格书
7页 296K
描述
Complementary MOSFET

2NP09 数据手册

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SMD Type  
MOSFET  
N-Ch and P-Ch MOSFET  
2NP09  
Features  
N-Channel  
PDFN5x6-8A  
V
DS = 40V  
= 32A  
RDS(ON) < 16mΩ  
P-Channel  
DS = -40V  
= -22A  
RDS(ON) < 30mΩ  
I
D
V
ID  
Top View  
Advanced high cell density Trench technology  
Super Low Gate Charge  
1
8
S1  
D1  
D1  
D2  
D2  
2
3
7
6
Excellent CdV/dt effect decline  
100% EAS Guaranteed  
G1  
S2  
4
5
G2  
8
7
5
6
2
1
4
3
Absolute Maximum Ratings (T  
a
= 25Unless otherwise specified)  
Symbol  
Parameter  
Drain-Source Voltage  
N-Channel P-Channel  
Unit  
V
V
DS  
GS  
40  
±20  
32  
-40  
±20  
-22  
-17  
-41  
20  
Gate-Source Voltage  
V
T
C
=25℃  
Continuous Drain Current (Note 1)  
ID  
TC  
=100℃  
21  
A
Pulsed Drain Current (Note 2)  
IDM  
47  
Single Pulse Avalanche Energy (Note 3)  
Maximum Power Dissipation (Note 4)  
Thermal Resistance, Junction- to-Ambient (Note 1)  
Thermal Resistance, Junction- to-Case (Note 1)  
Junction Temperature  
E
AS  
18  
mJ  
W
TC=25℃  
P
D
25  
62  
5
R
θJA  
θJC  
/W  
R
T
J
150  
Storage Temperature Range  
Tstg  
-55 to 150  
Notes 1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2. The data tested by pulsed , pulse width 300us , duty cycle 2%.  
3. The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=17.8A.  
4. The power dissipation is limited by 150junction temperature.  
1
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