SMD Type
MOSFET
T
Silicon P,N Channel MOSFET
2NP04
Ƶ Features
SOP-8
Unit:mm
ƽ Low drain-source ON-resistance:
P Channel RDS(ON) = 38m¡(typ.)(VGS=-10V)
N Channel RDS(ON) = 38mȍ(typ.)(VGS=10V)
ƽ High forward transfer admittance:
P Channel |Yfs| = 7.3S (typ.)
0.15
1.50
N Channel |Yfs| = 8S (typ.)
1㸬Source1
2㸬Gate1
5㸬Drain2
6㸬Drain2
7㸬Drain1
8㸬Drain1
ƽ Low leakage current:
3㸬Source2
4㸬Gate2
P Channel IDSS = -10ȝA(max)(VDS=-30V)
N Channel IDSS = 10ȝA(max)(VDS=30V)
ƽ Enhancement mode:
P Channel Vth = -0.8 to -2.0 V (VDS = -10V, ID = -1mA)
N Channel Vth = 1.3 to 2.5 V (VDS = 10V, ID = 1mA)
Ƶ Absolute Maximum Ratings Ta = 25ć
Circuit Configuration
Characteristics
Drain-source voltage
Symbol
Rating
Unit
8
7
5
6
V
−30
−30
20
30
30
V
V
V
DSS
Drain-gate voltage (R
Gate-source voltage
= 20 k
)
V
GS
DGR
V
20
GSS
DC
(Note 1)
(Note 1)
I
−4
4
D
Drain
current
A
Pulse
I
−16
16
DP
Single-device operation
(Note 3a)
Drain power
dissipation
(t = 5 s)
P
P
P
P
1.48
1.23
0.58
0.36
1.48
1.23
0.58
0.36
D (1)
2
Marking (Note 6)
1
4
3
Single-device value at
dual operation (Note 3b)
D (2)
D (1)
D (2)
(Note 2a)
W
Single-device operation
(Note 3a)
Drain power
dissipation
(t = 5 s)
8
7
6
5
Single-device value at
dual operation (Note 3b)
(Note 2b)
Single pulse avalanche energy
(Note 4)
E
2.6
2.6
2
mJ
A
AS
8404
Avalanche current
I
−2
AR
Repetitive avalanche energy
Single-device value at dual operation
(Note 2a, 3b, 5)
E
0.009
150
mJ
AR
1
2
3
4
Channel temperature
T
°C
°C
ch
Storage temperature range
T
−55 to 150
stg
Note: For Notes 1 to 5, refer to the next page.
1
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