2N7002KDWBQ
Features
• Trench Power LV MOSFET technology
• AEC-Q101 Qualified
DUAL
• ESD Protected up to 2KV (HBM)
• Moisture Sensitivity Level 1
• Halogen Free. “Green” Device (Note1)
N-CHANNEL
• Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
MOSFET
Maximum Ratings
•
•
Operating Junction Temperature Range : -55°C to +150°C
Storage Temperature Range: -55°C to +150°C
SOT-363
•
Thermal Resistance:515°C/W Junction to Ambient(Steady-State)(Note2)
G
Parameter
Rating
60
Symbol
VDS
Unit
V
C
B
Drain-Source Voltage
Gate-Source Volltage
VGS
±20
V
A
M
TA=25°C
220
140
H
Continuous Drain Current
mA
ID
TA=100°C
K
L
J
Pulsed Drain Current(Note3)
Total Power Dissipation(Note4)
IDM
PD
0.88
0.24
A
D
W
DIMENSIONS
MM
MIN MAX MIN MAX
0.006 0.014 0.15 0.35
0.045 0.053 1.15 1.35
0.079 0.096 2.00 2.45
INCHES
Note:
DIM
NOTE
TYP.
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
A
B
C
D
G
H
J
K
L
M
2. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz.
Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based on
RθJA tʇꢀ10s and the maximum allowed junction temperature of 150°C. The value in any
given application depends on the user's specific board design.
0.026
0.65
0.047 0.055 1.20 1.40
0.071 0.087 1.80 2.20
----- 0.004 ----- 0.10
0.031 0.043 0.80 1.10
0.010 0.018 0.26 0.46
0.003 0.006 0.08 0.15
3. Repetitive rating; pulse width limited by max. junction temperature.
4. PD is based on max. junction temperature, using junction to Ambient thermal resistance.
Internal Structure and Marking Code
SUGGESTED SOLDER PAD LAYOUT
D1
G2
S2
6
5
4
4
6
5
72KD
1
2
3
1
2
3
S1
G1
D2
Dot denotes Pin1
Rev.4-1-12202022
1/6
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